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000 cam c
001 2210080900537
005 20210513141803
007 ta
008 210513s2021 ulkak 001c kor
020 a9791156109471g93560 :c\38000
035 a(KERIS)REW000000397004
040 a221008
041 akorheng
056 a581.3525
245 00 aCMP 웨이퍼 연마 /d수리야데바라 바부 저 ;e장인배 역
260 a서울 :b씨아이알,c2021
300 a599 p. :b천연색삽화, 서식 ;c26 cm
500 00 a원저자명: Suryadevara Babu
504 a참고문헌과 색인수록
507 tAdvances in chemical mechanical planarization
653 aCMPa웨이퍼a연마
700 aBabu, Suryadevara,e저
700 a장인배,e역
900 a바부, 수리야데바라
940 a씨엠피 웨이퍼 연마
950 0 b\38000
CMP 웨이퍼 연마
Material type
단행본 국내서
Title
CMP 웨이퍼 연마
Author's Name
Publication
서울 : 씨아이알 2021
Physical Description
599 p : 천연색삽화, 서식 ; 26 cm
Keyword
원저자명: Suryadevara Babu / 참고문헌과 색인수록
Subject

Holdings Information

Call no. : 581.35 장68씨
RReservation
MMissing Book Request
CClosed Stack Request
IInter-Campus Loan
CPriority Cataloging
PPrint
Registration no. Vol. Copy Location Mark Location Status Due for return Service
Registration no.
E1388332
Vol. Copy
Location Mark
Location
한림기술자연자료실(승학)
Status
대출가능
Due for return
Service
MMissing Book Request
IInter-Campus Loan
Registration no.
E1388333
Vol. Copy
=2
Location Mark
Location
부민자료실
Status
대출가능
Due for return
Service
MMissing Book Request
IInter-Campus Loan

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