| 000 | cam a | |
| 001 | 2210080636153 | |
| 005 | 20080205104618 | |
| 007 | ta | |
| 008 | 980212s1990 njua b 001 0 eng | |
| 014 | ▼a89-22834 | |
| 020 | ▼a0815512201:▼86.00 | |
| 035 | ▼a(KERIS)BIB000000358962 | |
| 040 | ▼a211032▼c211032▼d221008 | |
| 050 | ▼aTA2020 ▼b.H37 1990 | |
| 082 | ▼a621.044 ▼c19 | |
| 245 | 00 | ▼aHandbook of plasma processing technology/▼cfundamentals,etching,deposition,and surface interactions/▼cedited by Stephen M.Rossnagel, Jerome J.Cuomo, William D.Westwood |
| 260 | ▼aPark Ridge,N.J.,U.S.A.:▼bNoyes Publications,▼cc1990. | |
| 300 | ▼axxiii,523 p.:▼bill.;▼c25 cm | |
| 440 | ▼aMaterials science and process technology series | |
| 504 | ▼aIncludes bibliographical references. | |
| 505 | ▼aHollow cathode etching and deposition/Chris M.Horwitz -- Ion platting/Donald M.Mattox -- Ionized cluster beam (ICB) deposition techniques/Isao Yamada -- The activated reactive evaporation (ARE) process/Chandra V.Deshpandey and Rointan F.Bunshah -- Formation of thin films by remote plasma enhanced chemical vapor deposition (Remote PECVD)/Gerold Lucovsky,David V.Tsu and Robert J.Markunas -- Selective bias sputter deposition/Soren Berg and Claes Nender -- Formation of thin films by remote plasma enhanced chemical vapor deposition (Remote PECVD)/Gerold Lucovsky,David V.Tsu and Robert J.Markunas -- Selective bias sputter deposition/Soren Berg and Claes Nender -- Vacuum arc-based processing/David Sanders -- Ion-surface interactions:general understandings/Russell Messier,Joseph E.Yehoda and Lawrence J.Pilione -- Ion assisted deposition/James J.McNally. | |
| 505 | ▼aMicrostructural control of plasma-sputtered refractory coatings/David M.Hoffman and Robert C.McCune. | |
| 505 | ▼aTechniques for IC processing/David B.Fraser and William D.Westwood -- Introduction to plasma concepts and discharge configurations/Joseph L.Cecchi -- Fundamentals of sputtering and reflection/David N.Ruzic -- Bombardment-induced compositional change with alloys,oxides,oxysalts,and halides/Roger Kelly -- RF diode sputter etching and deposition/Joseph S.Logan -- Magnetron plasma deposition processes/Stephen M.Rossnagel -- Broad-beam ion sources/Harold R.Kaufman and Raymond S.Robinson -- Reactive ion etching/Gottlieb S.Oehrlein -- Reactive sputter deposition/William D.Westwood -- Plasma enhanced chemical vapor deposition of thin films for microelectronics/Rafael Reif -- Electron cyclotron resonance microwave discharges for etching and thin film deposition/Jes Asmussen. | |
| 650 | ▼aPlasma engineering. | |
| 650 | ▼aPlasma etching. | |
| 650 | ▼aSemiconductors --Etching. | |
| 700 | ▼aCuomo,J.J | |
| 700 | ▼aRossnagel,Stephen M | |
| 700 | ▼aWestwood,William D.▼q(William Dickson),▼d1937- | |
| 950 | 0 | ▼b＄134.00 |
Handbook of plasma processing technology
Material type
단행본 서양서
Title
Handbook of plasma processing technology
Author's Name
총서명
Materials science and process technology series
Publication
Park Ridge,N.J.,U.S.A.: Noyes Publications c1990.
Physical Description
xxiii,523 p: ill.; 25 cm
Keyword
Includes bibliographical references.
ISBN
Holdings Information
Call no. : 621.044 R710H
RReservation
MMissing Book Request
CClosed Stack Request
IInter-Campus Loan
CPriority Cataloging
PPrint
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Registration no.
W0196656
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Call no.
621.044 R710H
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Location Mark
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Location
자연대보존서고Ⅱ
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Status
대출가능
|
Due for return
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