Library Catalog

>>
Library Catalog
>
000 camIi
001 2210080897817
003 OCoLC
005 20210225115105
006 m d
007 cr |n|||||||||
008 180910s2018 xxk ob 001 0 eng d
019 a1053582309
020 a9781785614927q(electronic bk.)
020 a1785614924q(electronic bk.)
020 z1785614916
020 z9781785614910
035 a1882218b(NT)
035 a(OCoLC)1051214848z(OCoLC)1053582309
040 aCDNbengerdaepncCDNdCDNdNdYDXdEBLCPdOTZd221008
050 aQC611.8.W53bW36 2018eb
072 aTECx0090702bisacsh
072 aB01002inspec
072 aB11102inspec
072 aB2560P2inspec
082 a621.38152223
100 aWang, Fei (Fred),eauthor.
245 00 aCharacterization of wide bandgap power semiconductor devices /cFei (Fred) Wang, Zheyu Zhang, and Edward A. Jones.
260 aStevenage, United Kingdom :bInstitution of Engineering and Technology,c2018.
300 a1 online resource (ix, 333 pages).
336 atextbtxt2rdacontent
337 acomputerbc2rdamedia
338 aonline resourcebcr2rdacarrier
490 aIET Energy Engineering ;v128
504 aIncludes bibliographical references and index.
505 aIntro; Contents; Biographies; Acknowledgments; 1. Introduction; 1.1. Overview of WBG devices; 1.1.1. WBG devices in comparison to Si devices; 1.1.2. WBG device status; 1.2. Motivation for WBG device characterization; 1.3. About this book; References; 2. Pulsed static characterization; 2.1. Fundamentals of pulsed I-V testing; 2.2. Test equipment description; 2.3. Test fixture selection/design; 2.4. Junction temperature control; 2.5. Cryogenic device testing; 2.6. Pulse waveform timing; 2.7. Output (Id-Vds) characteristic; 2.8. Transfer (Id-Vgs) characteristic
505 a2.9. Gate current (Ig,ss-Vgs) characteristic2.10. Drain-source leakage (Id,off-Vds) characteristic; 2.11. Summary; References; 3. Junction capacitance characterization; 3.1. Fundamentals of C-V testing; 3.2. Test equipment description; 3.3. Test fixture selection/design and calibration; 3.4. Output capacitance (Coss) characteristic; 3.5. Input capacitance (Ciss) characteristic; 3.6. Reverse transfer capacitance (Crss) characteristic; 3.7. Gate charge (Qg) characteristic; 3.8. Calculation of Coss-related switching energies; 3.9. Summary; References; 4. Fundamentals of dynamic characterization
505 a4.1. Switching commutation analysis4.2. Fundamentals of DPT; 4.3. DPT design; 4.3.1. Load inductor; 4.3.2. DC source; 4.3.3. DC capacitor; 4.3.4. Bleeder resistor; 4.4. DPT control; 4.5. Case study; 4.5.1. Load inductor; 4.5.2. DC source; 4.5.3. DC capacitor bank; 4.5.4. Bleeder resistor; 4.5.5. DPT control; 4.6. Summary; References; 5. Gate drive for dynamic characterization; 5.1. Gate drive fundamentals; 5.2. Gate drive-related key device characteristics; 5.2.1. Gate drive design considering device static characteristics; 5.2.2. Gate drive design considering device dynamic characteristics
505 a5.3. Gate drive design5.3.1. Signal isolator; 5.3.2. Isolated power supply; 5.3.3. Gate drive IC; 5.3.4. Gate resistor; 5.3.5. Decoupling capacitor; 5.4. Case study; 5.4.1. Signal isolator; 5.4.2. Isolated power supply; 5.4.3. Gate drive IC; 5.4.4. Gate resistor; 5.4.5. Decoupling capacitor; 5.5. Summary; References; 6. Layout design and parasitic management; 6.1. Impact of parasitics on the switching performance; 6.1.1. Gate loop parasitics; 6.1.2. Power loop parasitics; 6.1.3. Common parasitics; 6.2. DPT layout design; 6.3. Case study; 6.3.1. Brief overview of WBG devices' package
505 a6.3.2. Case study 1: TO-247 package SiC MOSFETs6.3.3. Case study 2: surface-mount WBG device; 6.3.4. With consideration of current measurement in DPT; 6.3.5. Gate drive; 6.4. Summary; References; 7. Protection design for double pulse test; 7.1. Overview of state-of-the-art protection scheme for WBG devices; 7.2. Solid-state circuit breaker; 7.2.1. Operation principle; 7.2.2. Circuit implementation and design consideration; 7.2.3. Test setup and procedure; 7.2.4. Case study; 7.3. Consideration for high-voltage WBG device DPT; 7.3.1. Safety consideration; 7.3.2. Protection scheme; 7.4. Summary
520 aThis book is an authoritative overview of Wide Bandgap (WBG) device characterization providing essential tools to assist the reader in performing both static and dynamic characterization of WBG devices, particularly those based on using silicon carbide (SiC) and gallium nitride (GaN) power semiconductors.
588 aOnline resource; Title from pdf title page (IET Digital Library, viewed September 10, 2018).
590 aMaster record variable field(s) change: 072
650 aWide gap semiconductors.
650 aPower semiconductors.
650 aElectric capacity.
650 aTECHNOLOGY & ENGINEERING / Mechanical.2bisacsh
655 aElectronic books.
700 aZhang, Zheyu,eauthor.
700 aJones, Edward A.,c(Engineer),eauthor.
776 iPrint version:aWANG, FEI. ZHANG, ZHEYU. JONES, EDWARD A.tCHARACTERIZATION OF WIDE BANDGAP POWER SEMICONDUCTOR DEVICES.d[S.l.] : INST OF ENGIN AND TECH, 2018z1785614916w(OCoLC)1022475837
830 aIET energy engineering series ;v128.
856 3EBSCOhostuhttp://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=1882218
938 aEBL - Ebook LibrarybEBLBnEBL5520140
938 aEBSCOhostbEBSCn1882218
938 aYBP Library ServicesbYANKn15703395
994 a92bN
Characterization of wide bandgap power semiconductor devices /Fei (Fred) Wang, Zheyu Zhang, and Edward A. Jones
Material type
전자책
Title
Characterization of wide bandgap power semiconductor devices /Fei (Fred) Wang, Zheyu Zhang, and Edward A. Jones
Author's Name
Publication
Stevenage, United Kingdom : Institution of Engineering and Technology 2018.
Physical Description
1 online resource (ix, 333 pages)
Keyword
Includes bibliographical references and index. / This book is an authoritative overview of Wide Bandgap (WBG) device characterization providing essential tools to assist the reader in performing both static and dynamic characterization of WBG devices, particularly those based on using silicon carbide (SiC) and gallium nitride (GaN) power semiconductors.
관련 URL

Holdings Information

RReservation
MMissing Book Request
CClosed Stack Request
IInter-Campus Loan
CPriority Cataloging
PPrint
Registration no. Call no. Location Mark Location Status Due for return Service
전자자료는 소장사항이 존재하지 않습니다

Book Overview

Full menu