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1 . Academic Journal
In-situ characterization up to 100 GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies
저자
by
Houzet, Gregory
;
Lacrevaz, Thierry
;
Bermond, Cedric
;
Artillan, Philippe
;
Auchère, David
, et al.
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In
Microelectronics Journal
February 2021 108
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7 . Academic Journal
Effect of water content on microwave dielectric properties of building materials
저자
by
Damez, Romain
;
Artillan, Philippe
;
Hellouin de Menibus, Arthur
;
Bermond, Cédric
;
Xavier, Pascal
.
소스
In
Construction and Building Materials
10 December 2020 263
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7 . Conference
Optimization of a Miniaturized Ethernet 10 Gbits/s 8 Conductors Interconnect for Harsh Environments
저자
by
BOUJMAD, Younes
;
ARTILLAN, Philippe
;
BERMOND, Cedric
;
GAVARD, Olivier
;
PRUDHOM, Marie
, et al.
소스
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2019 IEEE 23rd Workshop on. :1-4 Jun, 2019
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7 . Conference
Turnkey Methodology for Characteristic Impedance Extraction of Embedded Transmission Lines
저자
by
Houzet, Gregory
;
Artillan, Philippe
;
Bermond, Cedric
;
Lacrevaz, Thierry
;
Flechet, Bernard
.
소스
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2019 IEEE 23rd Workshop on. :1-4 Jun, 2019
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7 . Conference
Fast and robust RF characterization method of insulators used in high speed interconnects networks
저자
by
Lacrevaz, Thierry
;
Houzet, Gregory
;
Auchere, David
;
Artillan, Philippe
;
Bermond, Cedric
, et al.
소스
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2018 IEEE 22nd Workshop on. :1-4 May, 2018
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7 . Periodical
A Closed-Form Expression for the Frequency-Dependent Microwave Responsivity of Transistors Based on the I–V Curve and S-Parameters
저자
by
Paz-Martinez, Gaudencio
;
Artillan, Philippe
;
Mateos, Javier
;
Rochefeuille, Edouard
;
Gonzalez, Tomas
, et al.
소스
IEEE Transactions on Microwave Theory and Techniques; January 2024, Vol. 72 Issue: 1 p415-420, 6p
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7 . Conference
3D interconnect optimization for single channel 100-GBps transmission in a photonic interposer
저자
by
Morot, Kevin
;
Farcy, Alexis
;
Lacrevaz, Thierry
;
Bermond, Cedric
;
Artillan, Philippe
, et al.
소스
2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2017 IEEE 21st Workshop on. :1-4 May, 2017
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7 . Conference
High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer
저자
by
Dieng, Khadim
;
Bermond, Cedric
;
Artillan, Philippe
;
Guiller, Olivier
;
Lacrevaz, Thierry
, et al.
소스
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2016 IEEE 20th Workshop on. :1-4 May, 2016
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7 . Conference
Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations
저자
by
Dieng, Khadim
;
Bermond, Cedric
;
Artillan, Philippe
;
Guiller, Olivier
;
Lacrevaz, Thierry
, et al.
소스
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :74-81 May, 2016
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7 . Conference
Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network
저자
by
Dieng, Khadim
;
Artillan, Philippe
;
Bermond, Cedric
;
Guiller, Olivier
;
Lacrevaz, Thierry
, et al.
소스
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :247-253 May, 2015
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