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41 . Academic Journal
Parameters determination for modelling of copper electrodeposition in through-silicon-via with additives
저자
by
Wang, Yan
;
Deng, Xin
;
Ren, Xinyu
;
Li, Xiang
;
Wang, Fuliang
, et al.
소스
In
Microelectronic Engineering
5 September 2018 196:25-31
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47 . Academic Journal
Urban green effects on land surface temperature caused by surface characteristics: A case study of summer Beijing metropolitan region
저자
by
Zhang, Yazhou
;
Zhan, Yulin
;
Yu, Tao
;
Ren, Xinyu
.
소스
In
Infrared Physics and Technology
November 2017 86:35-43
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46 . Periodical
TraInterSim: Adaptive and Planning-Aware Hybrid-Driven Traffic Intersection Simulation
저자
by
Lv, Pei
;
Pei, Xinming
;
Ren, Xinyu
;
Zhang, Yuzhen
;
Li, Chaochao
, et al.
소스
IEEE Transactions on Visualization and Computer Graphics; August 2024, Vol. 30 Issue: 8 p5750-5764, 15p
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47 . Academic Journal
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition
저자
by
Wang, Fuliang
;
Zeng, Peng
;
Wang, Yan
;
Ren, Xinyu
;
Xiao, Hongbin
, et al.
소스
In
Microelectronic Engineering
5 August 2017 180:30-34
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47 . Academic Journal
Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution
저자
by
Wang, Fuliang
;
Ren, Xinyu
;
Zeng, Peng
;
Xiao, Hongbin
;
Wang, Yan
, et al.
소스
In
Microelectronic Engineering
5 August 2017 180:25-29
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47 . Academic Journal
Evaluating differences in forest fragmentation and restoration between western natural forests and southeastern plantation forests in the United States
저자
by
Ren, Xinyu
;
Lv, Yingying
;
Li, Mingshi
.
소스
In
Journal of Environmental Management
1 March 2017 188:268-277
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45 . Academic Journal
Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives
저자
by
Xiao, Hongbin
;
He, Hu
;
Ren, Xinyu
;
Zeng, Peng
;
Wang, Fuliang
.
소스
In
Microelectronic Engineering
25 February 2017 170:54-58
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47 . Academic Journal
RETRACTED: Group travel recommendation model study based on spatial and temporal integration factors.
저자
by
Ren, Xinyu
;
Yang, Wanhe
;
Yang, Hui
.
소스
Journal of Intelligent & Fuzzy Systems
. Apr2024, p1-12. 12p.
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45 . Report
TraInterSim: Adaptive and Planning-Aware Hybrid-Driven Traffic Intersection Simulation
저자
by
Lv, Pei
;
Pei, Xinming
;
Ren, Xinyu
;
Zhang, Yuzhen
;
Li, Chaochao
, et al.
소스
Open Access (Arxiv)
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47 . Academic Journal
Effect of holding time on interfacial evolution and mechanical strength of wide-gap brazed K417G superalloy joints
저자
by
Ren, Xinyu
;
Wang, Hao
;
Li, Wenwen
;
Dong, Qi
;
Chen, Bo
, et al.
소스
Welding in the World: The International Journal of Materials Joining
. :1-6
Web of Science
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