Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate
- Resource Type
- Conference
- Authors
- Matsumae, T.; Kurashima, Y.; Takagi, H.; Umezawa, H.; Watanabe, H.; Ito, T.; Higurashi, E.
- Source
- 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :99-100 May, 2022
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Heating systems
Thermal resistance
Thermal management
Thermal conductivity
Diamond
Power electronics
Bonding
Ga2O3
diamond
thermal management
direct bonding
- Language
A β-Ga 2 O 3 film was directly bonded with a diamond heat spreader for efficient heat dissipation. Ga 2 O 3 is expected as a future material for power electronics, but it has a heat dissipation problem due to its low thermal conductivity. We demonstrated that thermal resistance could be improved by direct bonding with a diamond heat spreader.