The Hidden Challenges in Manufacturing Variations
- Resource Type
- Conference
- Authors
- Sayfan-Altman, S.; Bloch, R.; Manukovsky, A.
- Source
- 2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) Microwaves, Antennas, Communications and Electronic Systems (COMCAS), 2021 IEEE International Conference on. :465-469 Nov, 2021
- Subject
- Aerospace
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Fields, Waves and Electromagnetics
General Topics for Engineers
Photonics and Electrooptics
Signal Processing and Analysis
Transportation
Microwave antennas
Degradation
Manufacturing processes
Design methodology
Capacitors
Microwave communication
Microwave theory and techniques
High speed board design
capacitors footprint optimization
112Gb channel design
robust design
PCB manufacturing variation
misregistration
- Language
In this work we will examine the manufacturing variation effect and design robustness in the context of complex PCB structures’ performance for high-speed links. A case study of robust design implementation for a differential capacitor structure is examined. The main design parameters variation is identified and key contributors to performance degradation are outlined. Then a method of maximizing design robustness is presented and a commonly used design is altered to maximize immunity to manufacturing variation. The proposed structure robustness is analyzed, and superior impedance control under various scenarios of expected manufacturing variation is demonstrated.