High Density Silicon Photonic Integrated Circuits and Photonic Engine for Optical Co-packaged Ethernet Switch
- Resource Type
- Conference
- Authors
- Liao, Ling; Fathololoumi, Saeed; Hui, David
- Source
- 2020 European Conference on Optical Communications (ECOC) Optical Communications (ECOC), 2020 European Conference on. :1-4 Dec, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Signal Processing and Analysis
Integrated circuits
Optical switches
IEEE 802.3 Standard
Silicon
Optical fiber communication
Photonics
Fiber lasers
- Language
We present performance of 1.6 Tbps silicon photonic integrated circuits (SiPICs) and their key device components. These high bandwidth density SiPICs enabled fully functional photonic engines (PEs) that can be co-packaged with Ethernet switches and demonstrated IEEE standards compliant interop-link with 400 Gbps DR4 modules.