Wafer-level technology for sub-mm wave focal plane arrays
- Resource Type
- Conference
- Authors
- Mehdi, Imran; Chattopadhyay, Goutam; Lee, Choonsup; Reck, Theodore; Jung, Cecile; Siles, Jose; Cooper, Ken; Llombart, Nuria
- Source
- 2012 7th European Microwave Integrated Circuit Conference Microwave Integrated Circuits Conference (EuMIC), 2012 7th European. :230-233 Oct, 2012
- Subject
- Fields, Waves and Electromagnetics
Computing and Processing
Components, Circuits, Devices and Systems
Receivers
Antenna arrays
Imaging
Silicon
Lenses
Buildings
Schottky diodes
Focal plane arrays
submillimeter imaging arrays
receiver front ends
- Language
A robust and compact scheme for building Submm-wave array receivers will be presented in this paper. By utilizing wafer-level integration the scheme enables compact multi-pixel modules. Bulk Silicon Deep Reactive Ion Etching techniques are used to build waveguides that allow the RF signals to be routed in the third dimension. Finally, a novel micro-lens antenna has been designed; fabricated and characterized that allows the antenna array to be fabricated via standard photolithography thus making it possible to build a beam-forming array. Preliminary work has focused on demonstrating a single pixel 500–600 GHz receiver front end and the characterization of the micro-lens.