N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+Memory Ultra-Dense 3D, 3D Thermal Scaffolding
- Resource Type
- Conference
- Source
- 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
- Subject
Bioengineering Communication, Networking and Broadcast Technologies Components, Circuits, Devices and Systems Computing and Processing Engineered Materials, Dielectrics and Plasmas Fields, Waves and Electromagnetics Nuclear Engineering Photonics and Electrooptics Power, Energy and Industry Applications Robotics and Control Systems Signal Processing and Analysis Three-dimensional displays Industrial facilities Delays Electron devices - Language
- ISSN
- 2156-017X