Enhanced failure and contamination analysis of challenging microelectronics specimen with optical photothermal infrared spectroscopy
- Resource Type
- Conference
- Authors
- Lau, Angelina; Tan, Peng Hui; Lo, Michael K. F.
- Source
- 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Photonics and Electrooptics
Signal Processing and Analysis
Integrated circuits
Spectroscopy
Sensitivity
Shape
Failure analysis
Microelectronics
Optical sensors
infrared
Raman
sub-micron
O-PTIR
simultaneous
photothermal
sub-surface
pry off
cross-section
failure
contamination
particle
particulate
chemistry
spectroscopy
imaging
pump-probe
- Language
- ISSN
- 1946-1550
Failure and contamination analysis of small, sub-surface, and complex layers and particles in components represent a major set of common microelectronics and semiconductor issues. The application of O-PTIR spectroscopy analyses provide flexibilities to sample preparation and sensitivity to very thin and very small (less than 10 µm) layers or particles. The normal band shapes offered by the O-PTIR yields high confidence towards accurate unknown identification and process enhancement. Most conveniently, standard sample preparation techniques are compatible with this novel analytical tool for the presented case studies.