Integrated Optical Interconnection System (iOIS) is proposed for the first time for computing and communication systems by leveraging the 3DFabric platform. We propose the use of the second-generation COUPE (iOIS_COUPE2.0) as the optical engine with CoWoS-based composite interposer (iOIS_CI) as the integration platform for HPC, and networking applications. In COUPE2.0, a vertical broad-band coupler is integrated with the embedded microlens with a loss of 0.3 dB and alignment tolerance of ±10 μm. While in CI, a highly integrated electrical and optical interconnection layer can provide an electrical interconnect with 37.2× electrical bandwidth density with 0.19× energy consumption between ASIC and OE (compared with the conventional MCM solution with the micro-bump-based OE). The integrated single mode optical routing layer can yield propagation loss of 0.21 dB/cm and a 90-degree bending loss of 0.009 dB/turn. The multi-layer waveguide system features a 0.015 dB transition loss between adjacent layers and a beachfront bandwidth density up to 44.9 Tbps/mm for 100 Gbps single channel data rate. A specially designed optical interface between COUPE2.0 and CI not only provides low coupling loss of 0.015 dB but also paves the way for future heterogeneous integration of various non-silicon optical functional blocks. The broad-band vertical coupler in COUPE2.0 and waveguide system in CI are seamlessly integrated to provide performance and flexibility in CPO optical system design. As 3DFabric™-based CPO solution, iOIS can meet the diversified technology demands and yield a cost-effective manufacturable solution in alignment with foundry's 2.5D/3D roadmap.