In Situ Monitoring of Creep Deformation in Single Crystal SAC305 Solder Joint at Different Temperatures
- Resource Type
- Conference
- Authors
- Bharamgonda, Aniket; Deshpande, Abhishek; Dasgupta, Abhijit
- Source
- 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-4 May, 2023
- Subject
- Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Transportation
Temperature measurement
Temperature sensors
Semiconductor device measurement
Deformation
Creep
Thermomechanical processes
Calibration
SAC305
oligocrystalline joint
single crystal
high temperature creep
hierarchical anisotropic modelling isothermal creep
Digital Image Correlation
Cross-Polarized Microscopy
- Language
- ISSN
- 2694-2135
Precise estimation of thermo-mechanical properties of single-crystals and grains boundaries is necessary for grain-scale modelling of oligocrystalline solder joints, which are common in modern-day microelectronic packages and assemblies. In this paper, monotonic creep tests are conducted on single crystal SAC305 solder joints at 25 and 125 °C with load between 20-30MPa. Cross-polarized microscopy was used to confirm that the solder joint had single grain. Experimental setup was updated for direct measurement of solder deformation and calibration methodology of measurement system was presented. New experimental results are presented for tensile creep of single crystal solder joints of sufficiently high aspect ratio to be representative of quad-flat-no-lead (QFN) packages and leadless chip carrier (LCC) packages. Room temperature test sample did not rupture under given load. High temperature testing revealed cracking in the solder joint. Effect of change in temperature and load on creep behavior of solder joint is presented. Experimental results and failure analysis (including EBSD assessment of grain orientation) will be used in calibration of crystal viscoplastic (CV) and continuum constitutive models across a range of temperatures.