Microstrip-to- Waveguide Transition with Bias Tee for Photodiode Packaging at W-Band
- Resource Type
- Conference
- Authors
- Nie, Chuang; Li, Qi; Yao, Yuan; Zhang, Ting; Yang, Yaohui
- Source
- 2022 Cross Strait Radio Science & Wireless Technology Conference (CSRSWTC) Cross Strait Radio Science & Wireless Technology Conference (CSRSWTC), 2022. :1-3 Dec, 2022
- Subject
- Computing and Processing
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Signal Processing and Analysis
Radio frequency
Waveguide transitions
Optical losses
Couplings
Rectangular waveguides
Insertion loss
Packaging
photodiode
bias tee
microstrip
E-plane probe
rectangular waveguide
- Language
- ISSN
- 2377-8512
This paper presents a novel concept for the integration of terahertz (THz) photodiodes (PD) with rectangular waveguide. The device features a bias tee and an E-plane microstrip-to-waveguide transition. The bias tee can prevent the leakage of the RF power while applying DC bias to the PD. The E-plane probe achieves power coupling from the microstrip to the WR-10 waveguide. The insertion loss of the full module is less than 0.2dB, and the RF isolation at the DC port is better than 17 dB over the whole W-band (75-110GHz). The transition features low loss and can be applied to the packaging of THz PDs to achieve an efficient connection between PD and rectangular waveguide.