Flexible Tactile Sensing Array with High Spatial Density Based on Parylene Mems Technique
- Resource Type
- Conference
- Authors
- Zhang, Meixuan; Wang, Zetian; Xu, Han; Chen, Lang; Jin, Yufeng; Wang, Wei
- Source
- 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2023 IEEE 36th International Conference on. :243-246 Jan, 2023
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Micromechanical devices
Pressure sensors
Young's modulus
Mass production
Microfabrication
Linearity
Skin
Flexible tactile sensing array
Parylene-filled trench
Silicon-based flexible electronics
Parylene MEMS
- Language
- ISSN
- 2160-1968
This paper reports a novel flexible tactile sensing array with high spatial density, large range and high linearity based on Parylene MEMS technique to mimic the human fingertips’ ability of static pressure detection. The proposed array is composed of piezoresistive pressure sensors and Parylene-filled trenches in between for high-resolution sensing and flexible connection separately. Inspired by sensory receptors in human skin, we successfully fabricated a flexible tactile sensing array with high spatial density (~156 cm -2 ), large range (0-2 MPa) and low nonlinearity (0.46% FS (full scale)). The excellent compatibility of Parylene MEMS technique to conventional microfabrication makes it possible for future microsystem to achieve both high performance and good flexibility.