非连续阻抗粘接结构脱粘缺陷的稀布阵列超声成像 / Thinned array ultrasonic imaging of debonding defects in discontinuous impedance bonded structures
- Resource Type
- Academic Journal
- Source
- 物理学报 / Acta Physica Sinica. 72(2):144-152
- Subject
超声成像 稀布阵列 非连续阻抗 脱粘 - Language
- Chinese
- ISSN
- 1000-3290