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1 . Academic Journal
微波印制电路板铣切工艺优化 / Optimization of microwave PCB milling technology
저자
by
王焕清
;
杨海宁
;
戴广乾
;
曾策
;
龚小林
, et al.
소스
印制电路信息 / Printed Circuit Information
. 31(5):30-34
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7 . Academic Journal
液晶聚合物复合基板在高频高可靠封装中的应用 / Application of Liquid Crystal Polymer Composite Substrate for High Frequency and High Reliability Packaging
저자
by
徐诺心
;
戴广乾
;
边方胜
;
林玉敏
;
曾策
, et al.
소스
电子工艺技术 / Electronics Process Technology
. 43(1):8-53
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7 . Academic Journal
微波印制电路板数控加工拼板软件开发与应用 / Development and application of panelization software for CNC process of microwave PCB
저자
by
曾策
;
谢国平
;
戴广乾
;
林玉敏
;
边方胜
, et al.
소스
印制电路信息 / Printed Circuit Information
. 29(8):1-6
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7 . Academic Journal
高导热复合基板制造技术 / Manufacturing Technology of Composite Substrate with High Thermal Conductivity
저자
by
林玉敏
;
彭挺
;
边方胜
;
戴广乾
;
龚小林
, et al.
소스
电子工艺技术 / Electronics Process Technology
. 42(1):12-15
Find it @ DONGA
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7 . Academic Journal
电镀金锡合金的影响因素 / Factors affecting gold–tin alloy electroplating
저자
by
林玉敏
;
彭挺
;
戴广乾
;
边方胜
;
LIN Yumin
, et al.
소스
电镀与涂饰 / Electroplating & Finishing
. 40(9):678-682
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7 . Academic Journal
基于微波印制电路板表面图形面积比的归一化电流计算方法及其电镀实践 / A normalized current calculation method based on graphic area ratio of microwave printed circuit board and its application in electroplating
저자
by
戴广乾
;
曾策
;
谢国平
;
阳晓明
;
边方胜
, et al.
소스
电镀与涂饰 / Electroplating & Finishing
. 39(23):1610-1614
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7 . Academic Journal
装挂对微波电路板背面金层厚度及金盐消耗的影响 / Effects of racking methods on gold coating thickness and gold salt consumption on backside of microwave printed circuit board //
저자
by
戴广乾
;
边方胜
;
徐榕青
;
曾策
;
陈全寿
, et al.
소스
电镀与涂饰 / Electroplating & Finishing
. 38(23):1262-1265
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RefWorks
7 . Academic Journal
激光技术在高密度互连印制板生产中的典型应用 / Typical Applications of Laser Technology in HDI PCB Industry
저자
by
谢国平
;
戴广乾
;
边方胜
;
Xie Guo-ping
;
Dai Guang-qian
, et al.
소스
印制电路信息 / Printed Circuit Information
. 26(2):36-41
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7 . Academic Journal
微波印制电路引线镀金厚度均匀性的改善 / Improvement of thickness uniformity of gold coatings electroplated on the leads of microwave printed circuits
저자
by
戴广乾
;
曾策
;
边方胜
;
许冰
;
闵显超
, et al.
소스
电镀与涂饰 / Electroplating & Finishing
. 37(15):687-693
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7 . Academic Journal
微波多层印制板的端口毛刺控制 / Burr Control and Debarring on Port of Multilayer Printed Circuit Board
저자
by
戴广乾
;
刘军
;
边方胜
;
Dai Guangqian
;
Liu Jun
, et al.
소스
工具技术 / Tool Engineering
. 51(11):98-101
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