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1 . Conference
Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)
저자
by
Ishikawa, Dai
;
Nakako, Hideo
;
Blank, Thomas
;
Wurst, Helge
;
Steiner, Felix
.
소스
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :233-234 Apr, 2023
Full Text (IEEE)
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7 . Conference
Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating
저자
by
Ishikawa, Dai
;
Blank, Thomas
;
Wurst, Helge
;
Steiner, Felix
;
Nakako, Hideo
.
소스
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :73-74 May, 2022
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7 . Conference
Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice
저자
by
Steiner, Felix
;
Wurst, Helge
;
Leyrer, Benjamin
;
Ishikawa, Dai
;
Nakako, Hideo
, et al.
소스
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :147-148 May, 2022
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7 . Conference
GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging
저자
by
Blank, Thomas
;
Dudek, Volker
;
Luh, Matthias
;
An, Bao Ngoc
;
Wurst, Helge
, et al.
소스
2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :92-97 Apr, 2019
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7 . Conference
Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers
저자
by
Ishikawa, Dai
;
An, Bao Ngoc
;
Mail, Matthias
;
Wurst, Helge
;
Leyrer, Benjamin
, et al.
소스
2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :167-172 Apr, 2019
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7 . Conference
Copper sintered Si3N4 Power Modules in Thermal Shock Tests
저자
by
Blank, Thomas
;
Zhang, Hongpeng
;
Wurst, Helge
;
Leyrer, Benjamin
;
Steiner, Felix
, et al.
소스
2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :95-96 May, 2021
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7 . Conference
Die-attach Properties of Pressure-sintered Copper Joints on Adhesive Metallization Surfaces in N2 Atmosphere
저자
by
Ishikawa, Dai
;
An, Bao Ngoc
;
Mail, Matthias
;
Wurst, Helge
;
Leyrer, Benjamin
, et al.
소스
2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :55-56 May, 2021
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7 . Conference
Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties
저자
by
Ishikawa, Dai
;
Nakako, Hideo
;
Kawana, Yuki
;
Sugama, Chie
;
Negishi, Motohiro
, et al.
소스
2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :01-10 Sep, 2018
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7 . Conference
A highly integrated copper sintered SiC power module for fast switching operation
저자
by
An, Bao Ngoc
;
Ishikawa, Dai
;
Blank, Thomas
;
Wurst, Helge
;
Demattio, Horst
, et al.
소스
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :375-380 Apr, 2018
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7 . Book
Online Washability: Comparison of Dual Parameter and Triple Parameter Analysis.
저자
by
Bachmann, Jan V P
;
Wurst, Helge
;
Cipold, Michael
;
Bachmann, Claus
.
소스
XVIII International Coal Preparation Congress; 2016, p255-260, 6p
Find it @ DONGA
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