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1 . Conference
Effects of Thermal Characteristics of Power Module on Electric Vehicle Inverter
저자
by
Liu, Chun-Kai
;
Chiu, Po-Kai
;
Hsu, Shi-Feng
;
Wu, Han-Lin
;
Wu, Sheng-Tsai
, et al.
소스
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :143-146 Dec, 2021
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7 . Conference
Electrical, Thermal and Stress Simulation Analyses of SiC MOSFET Power Integrated Module (PIM) Development
저자
by
Wu, Sheng-Tsai
;
Chiu, Po-Kai
;
Cheng, Yu-Hua
;
Lin, Hsin-Han
;
Wu, Han-Lin
, et al.
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2021 IEEE International Future Energy Electronics Conference (IFEEC) Future Energy Electronics Conference (IFEEC), 2021 IEEE International. :1-5 Nov, 2021
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7 . Conference
A novel multi-chip stacking technology development using a flip-chip embedded interposer carrier integrated in fan-out wafer-level packaging
저자
by
Lin, Yu-Min
;
Chiu, Wei-Lan
;
Chen, Chao-Jung
;
Ding, Hsiang-En
;
Lee, Ou-Hsiang
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1076-1081 Jun, 2021
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7 . Conference
Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging
저자
by
Lee, Chia-Hsin
;
Huang, Baron
;
See, Jennifer
;
Liu, Xiao
;
Lin, Yu-Min
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :736-741 Jun, 2021
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7 . Conference
Double-Sided Cooling SiC Power Module Packaging for Industrial Motor Driving System
저자
by
Liu, Chun-Kai
;
Wu, Sheng-Tsai
;
Lo, Yuan-Yin
;
Chiu, Po-Kai
;
Lin, Hsin-Han
, et al.
소스
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :105-108 Oct, 2020
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7 . Conference
An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
저자
by
Lin, Yu-Min
;
Wu, Sheng-Tsai
;
Wang, Chun-Min
;
Lee, Chia-Hsin
;
Huang, Shin-Yi
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1463-1469 May, 2019
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7 . Academic Journal
Thermo-mechanical analysis and interfacial energy release rate estimation for metal–insulator–metal capacitor device
저자
by
Hsieh, Ming-Che
;
Wu, Sheng-Tsai
;
Tain, Ra-Min
;
Chen, Chao-Huang
;
Lin, Cheng-Kuo
.
소스
In
Microelectronic Engineering
2011 88(5):779-784
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7 . Conference
An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications
저자
by
Lin, Yu-Min
;
Wu, Sheng-Tsai
;
Shen, Wen-Wei
;
Huang, Shin-Yi
;
Kuo, Tzu-Ying
, et al.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :349-354 May, 2018
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7 . Conference
Low-cost TSH (through-silicon hole) interposers for 3D IC integration
저자
by
Lau, John H.
;
Lee, Ching-Kuan
;
Zhan, Chau-Jie
;
Wu, Sheng-Tsai
;
Chao, Yu-Lin
, et al.
소스
2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :290-296 May, 2014
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7 . Conference
Interplay and influence of thermomechanical stress in copper-filled TSV interposers
저자
by
Wu, Sheng-Tsai
;
Chen, Cheng-fu
;
Chien, Heng-Chieh
.
소스
2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :963-966 May, 2014
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