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1 . Conference
A Deep Learning-Based Screening Method for Improving the Quality and Reliability of Integrated Passive Devices
저자
by
Chuang, Chien-Hui
;
Hou, Kuan-Wei
;
Wu, Cheng-Wen
;
Lee, Mincent
;
Tsai, Chia-Heng
, et al.
소스
2020 IEEE International Test Conference (ITC) Test Conference (ITC), 2020 IEEE International. :1-9 Nov, 2020
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7 . Conference
Novel Circuit Probing for Tiny Inductor
저자
by
Tsai, Chia-Heng
;
Lai, Chi-Chang
;
Chen, Hao
;
Wang, Min-Jer
.
소스
2020 IEEE International Test Conference in Asia (ITC-Asia) Test Conference in Asia (ITC-Asia), 2020 IEEE International. :31-34 Sep, 2020
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6 . Conference
Site-aware Anomaly Detection with Machine Learning for Circuit Probing to Prevent Overkill
저자
by
Lee, Mincent
;
Lu, Cheng-Tse
;
Tsai, Chia-Heng
;
Chen, Hao
;
Wang, Min-Jer
.
소스
2020 IEEE International Test Conference in Asia (ITC-Asia) Test Conference in Asia (ITC-Asia), 2020 IEEE International. :1-6 Sep, 2020
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7 . Conference
High Quality Test Methodology for Highly Reliable Devices
저자
by
Chen, Hao
;
Lee, Mincent
;
Chen, Liang-Yen
;
Wang, Min-Jer
.
소스
2019 IEEE International Test Conference (ITC) Test Conference (ITC), 2019 IEEE International. :1-6 Nov, 2019
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6 . Conference
Smart GDBC Screening for High Quality IPD
저자
by
Chen, Hao
;
Lin, Hung-Chih
;
Wang, Min-Jer
.
소스
2018 e-Manufacturing & Design Collaboration Symposium (eMDC) e-Manufacturing & Design Collaboration Symposium (eMDC), 2018. :1-4 Sep, 2018
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5 . Conference
Testing-for-manufacturing (TFM) for ultra-thin IPD on InFO
저자
by
Chiu, Tang-Jung
;
Tseng, Yu-Lun
;
Lin, Yen-Cheng
;
Wang, Yi-Chen
;
Lin, Hung-Chih
, et al.
소스
2017 International Test Conference in Asia (ITC-Asia) Test Conference in Asia (ITC-Asia), 2017 International. :90-95 Sep, 2017
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7 . Conference
Fan-out wafer level chip scale package testing
저자
by
Chen, Hao
;
Lin, Hung-Chih
;
Wang, Min-Jer
.
소스
2017 International Test Conference in Asia (ITC-Asia) Test Conference in Asia (ITC-Asia), 2017 International. :84-89 Sep, 2017
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5 . Conference
Heterogeneous Power Delivery for 7nm High-Performance Chiplet-Based Processors using Integrated Passive Device and In-Package Voltage Regulator
저자
by
Roth, Alan
;
Zhou, Charlie
;
Wong, Mei
;
Soenen, Eric
;
Huang, Tze-Chiang
, et al.
소스
2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
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7 . Conference
Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package
저자
by
Huang, Yu-Chieh
;
Lin, Bing-Yang
;
Wu, Cheng-Wen
;
Lee, Mincent
;
Chen, Hao
, et al.
소스
2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2016 53nd ACM/EDAC/IEEE. :1-6 Jun, 2016
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7 . Conference
Novel adaptive probing for wafer level chip scale package
저자
by
Lee, Mincent
;
Lin, Hung-Chih
;
Peng, Ching-Nen
;
Wang, Min-Jer
.
소스
2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM) e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM), 2015 Joint. :1-5 Sep, 2015
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