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1 . Conference
Why Should We Share Material Data? The Positive Impact of Public/Private Databases Access Through Digital Twins Along the Product Value Chain
저자
by
Holck, Ole
;
Voges, Steve
;
Becker, Karl-Friedrich
;
Wagner, Eduard
;
Schneider-Ramelow, Martin
.
소스
2024 Electronics Goes Green 2024+ (EGG) Electronics Goes Green 2024+ (EGG), 2024. :1-4 Jun, 2024
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7 . Conference
How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging
저자
by
Braun, Tanja
;
Holck, Ole
;
Adler, Marius
;
Obst, Mattis
;
Voges, Steve
, et al.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1-6 May, 2024
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7 . Conference
A Closer Look to Fan-out Panel Level Packaging
저자
by
Braun, Tanja
;
Holck, Ole
;
Voitel, Marcus
;
Obst, Mattis
;
Voges, Steve
, et al.
소스
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023
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7 . Conference
Panel Level Packaging – Where are the Technology Limits?
저자
by
Braun, Tanja
;
Holck, Ole
;
Obst, Mattis
;
Voges, Steve
;
Kahle, Ruben
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :807-818 May, 2022
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7 . Conference
Fan-out Wafer Level Packaging of GaN Components for RF Applications
저자
by
Braun, Tanja
;
Nguyen, Thanh Duy
;
Voges, Steve
;
Wohrmann, Markus
;
Gernhardt, Robert
, et al.
소스
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :7-13 Jun, 2020
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7 . Conference
Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
저자
by
Braun, Tanja
;
Becker, Karl-Friedrich
;
Hoelck, Ole
;
Voges, Steve
;
Kahle, Ruben
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :861-867 May, 2019
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7 . Conference
Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
저자
by
Fowler, Michelle
;
Massey, John P.
;
Braun, Tanja
;
Voges, Steve
;
Gernhardt, Robert
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :363-369 May, 2019
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7 . Conference
Recent Developments in Panel Level Packaging
저자
by
Braun, Tanja
;
Billaud, Mathilde
;
Zedel, Hannes
;
Stobbe, Lutz
;
Becker, Karl-Friedrich
, et al.
소스
2018 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2018 International. :1-7 Oct, 2018
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7 . Conference
Fabrication of 3D Hybrid Pixel Detector Modules Based on TSV Processing and Advanced Flip Chip Assembly of Thin Read Out Chips
저자
by
Zoschke, Kai
;
Opperman, Hermann
;
Fritzsch, Thomas
;
Rothermund, Mario
;
Oestermann, Ulf
, et al.
소스
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :917-924 May, 2017
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7 . Conference
Potential and challenges of fan-out panel level packaging
저자
by
Braun, Tanja
;
Becker, Karl-Friedrich
;
Kahle, Ruben
;
Raatz, Stefan
;
Topper, Michael
, et al.
소스
2016 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2016 IEEE. :132-136 Nov, 2016
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