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1 . Conference
Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates
저자
by
Nimbalkar, Pratik
;
Aguebor, Mercy
;
Kathaperumal, Mohanalingam
;
Swaminathan, Madhavan
;
Tummala, Rao
.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1603-1608 May, 2023
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7 . Conference
Maskless Lithography for High-Density Package Redistribution Layers
저자
by
Murali, Prahalad
;
Nimbalkar, Pratik
;
Kathaperumal, Mohanalingam
;
Losego, Mark D.
;
Tummala, Rao
, et al.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :147-151 May, 2023
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7 . Conference
Demonstration of Glass-based 3D Package Architectures with Embedded Dies for High Performance Computing
저자
by
Ravichandran, Siddharth
;
Smet, Vanessa
;
Swaminathan, Madhavan
;
Tummala, Rao
.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1114-1120 May, 2022
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6 . Conference
Novel zero side-etch process for
저자
by
Nimbalkar, Pratik
;
Bhaskar, Pragna
;
Blancher, Christopher
;
Kathaperumal, Mohanalingam
;
Swaminathan, Madhavan
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2168-2173 May, 2022
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7 . Academic Journal
Miniaturized and high-performance RF packages with ultra-thin glass substrates
저자
by
Kim, Min Suk
;
Pulugurtha, Markondeya Raj
;
Kim, Youngwoo
;
Park, Gapyeol
;
Cho, Kyungjun
, et al.
소스
In
Microelectronics Journal
July 2018 77:66-72
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7 . Academic Journal
Design, fabrication and characterization of thin power inductors with multilayered ferromagnetic-polymer composite structures
저자
by
Mishra, Dibyajat
;
Raj, P.Markondeya
;
Tummala, Rao
.
소스
In
Microelectronic Engineering
1 July 2016 160:34-38
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5 . Academic Journal
Chemical synthesis of low-coercivity, silica/Co composites for high-frequency magnetic components
저자
by
Sharma, Himani
;
Pulugurtha, Markondeya Raj
;
Tummala, Rao
.
소스
In
Materials Chemistry and Physics
1 June 2016 175:46-53
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5 . Conference
Reliability Modeling of Micro-vias in High-Density Redistribution Layers
저자
by
Nimbalkar, Pratik
;
Kathaperumal, Mohanalingam
;
Liu, Fuhan
;
Swaminathan, Madhavan
;
Tummala, Rao
.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :983-988 Jun, 2021
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7 . Conference
Effect of latching force on socketed BGA packages with Ni-Au coated solder spheres
저자
by
Gupte, Omkar
;
Murtagian, Gregorio
;
Tummala, Rao
;
Smet, Vanessa
.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2158-2164 Jun, 2021
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6 . Conference
Fabrication and reliability demonstration of 5μm redistribution layer using low-stress dielectric dry film
저자
by
Nimbalkar, Pratik
;
Liu, Fuhan
;
Watanabe, Atom
;
Weyers, David
;
Kathaperumal, Mohanalingam
, et al.
소스
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :62-67 Jun, 2020
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