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1 . Academic Journal
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
저자
by
Tikale, Sanjay
;
Prabhu, K. Narayan
.
소스
In
Microelectronics Reliability
October 2020 113
Full Text (ScienceDirect)
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4 . Academic Journal
Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles
저자
by
Tikale, Sanjay
;
Prabhu, K. Narayan
.
소스
In
Materials Science & Engineering A
10 June 2020 787
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4 . Academic Journal
Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions.
저자
by
Georgy, K.
;
Tikale, Sanjay
;
Prabhu, K. Narayan
.
소스
Materials Science & Technology; May2022, Vol. 38 Issue 8, p458-468, 11p
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5 . Academic Journal
Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate.
저자
by
Tikale, Sanjay
;
Narayan Prabhu, K.
.
소스
Journal of Materials Science: Materials in Electronics; Feb2021, Vol. 32 Issue 3, p2865-2886, 22p
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4 . Academic Journal
Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates.
저자
by
Sona, Mrunali
;
Tikale, Sanjay
;
Prabhu, Narayan
.
소스
Transactions of the Indian Institute of Metals; Jun2019, Vol. 72 Issue 6, p1579-1583, 5p
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5 . Academic Journal
Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles.
저자
by
Tikale, Sanjay
;
Prabhu, K. Narayan
.
소스
Transactions of the Indian Institute of Metals; Nov2018, Vol. 71 Issue 11, p2693-2698, 6p
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4 . Academic Journal
Assessment of the Performance of Sn-3.5Ag/Cu Solder Joint Under Multiple Reflows, Thermal Cycling and Corrosive Environment.
저자
by
Samuel, Augustine
;
Tikale, Sanjay
;
Prabhu, K. Narayan
.
소스
Transactions of the Indian Institute of Metals; Nov2018, Vol. 71 Issue 11, p2687-2691, 5p
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5 . Academic Journal
Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al
2
O
3
Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy.
저자
by
Tikale, Sanjay
;
Narayan Prabhu, K.
.
소스
Transactions of the Indian Institute of Metals; Nov2018, Vol. 71 Issue 11, p2855-2859, 5p
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4 . Academic Journal
Effect of Multiple Reflow Cycles and Al
2
O
3
Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy.
저자
by
Tikale, Sanjay
;
Prabhu, K. Narayan
.
소스
Journal of Materials Engineering & Performance; Jun2018, Vol. 27 Issue 6, p3102-3111, 10p
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4 . Periodical
Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al2O3Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy
저자
by
Tikale, Sanjay
;
Narayan Prabhu, K.
.
소스
Transactions of the Indian Institute of Metals; November 2018, Vol. 71 Issue: 11 p2855-2859, 5p
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