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1 . Academic Journal
On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing
저자
by
Civale, Yann
;
Croes, Kristof
;
Miyamori, Yuichi
;
Velenis, Dimitrios
;
Redolfi, Augusto
, et al.
소스
In
Microelectronic Engineering
June 2013 106:155-159
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7 . Conference
Challenges to via middle TSV integration at sub-28nm nodes
저자
by
Kamineni, Himani Suhag
;
Kannan, Sukeshwar
;
Alapati, Ramakanth
;
Thangaraju, Sarasvathi
;
Smith, Daniel
, et al.
소스
IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :199-202 May, 2014
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7 . Conference
Novel stress-free Keep Out Zone process development for via middle TSV in 20nm planar CMOS technology
저자
by
Rabie, Mohamed A.
;
S., Premachandran C.
;
Ranjan, Rakesh
;
Natarajan, Mahadevan Iyer
;
Yap, Sing Fui
, et al.
소스
IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :203-206 May, 2014
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7 . Conference
New interferometric measurement technique for small diameter TSV
저자
by
Timoney, Padraig
;
Fisher, Daniel
;
Yeong-Uk Ko
;
Vaid, Alok
;
Thangaraju, Sarasvathi
, et al.
소스
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI. :37-41 May, 2014
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7 . Conference
Correlation study of white light interferometer measurements with atomic force microscope measurements for post-CMP dishing measurements applied to TSV processing
저자
by
Fisher, Daniel W.
;
Timoney, Padraig
;
Yeong-Uk Ko
;
Vaid, Alok
;
Thangaraju, Sarasvathi
, et al.
소스
25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI. :270-273 May, 2014
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7 . Conference
Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications
저자
by
Jourdain, Anne
;
Buisson, Thibault
;
Phommahaxay, Alain
;
Redolfi, Augusto
;
Thangaraju, Sarasvathi
, et al.
소스
2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1122-1125 May, 2011
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7 . Conference
Thermal stability of copper Through-Silicon Via barriers during IC processing
저자
by
Civale, Yann
;
Croes, Kristof
;
Miyamori, Yuichi
;
Thangaraju, Sarasvathi
;
Redolfi, Augusto
, et al.
소스
2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011
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7 . Periodical
Metrology of white light interferometer for TSV processing
저자
by
Cain, Jason P.
;
Sanchez, Martha I.
;
Timoney, Padraig
;
Ko, Yeong-Uk
;
Fisher, Daniel
, et al.
소스
Proceedings of SPIE; April 2014, Vol. 9050 Issue: 1 p90500F-90500F-8, 814509p
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7 . Academic Journal
BMD impact on silicon fin defect at TSV bottom.
저자
by
Zhang, Dingyou
;
Thangaraju, Sarasvathi
;
Smith, Daniel
;
Kamineni, Himani
;
Klewer, Christian
, et al.
소스
Electronics Letters (Wiley-Blackwell)
. Jun2014, Vol. 50 Issue 13, p954-956. 3p.
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7 . Academic Journal
Technology Assessment of Through-Silicon Via by Using C–V and C–t Measurements.
저자
by
Katti, Guruprasad
;
Stucchi, Michele
;
Velenis, Dimitrios
;
Thangaraju, Sarasvathi
;
De Meyer, Kristin
, et al.
소스
IEEE Electron Device Letters; Jul2011, Vol. 32 Issue 7, p946-948, 3p
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