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1 . Conference
Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package
저자
by
Teng, Wen-Yu
;
Hung, Liang-Yih
;
Lee, Jackson
;
Li, Debby
;
Chen, Carl
, et al.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1993-1997 May, 2024
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7 . Conference
Advanced TIM Material Analysis for High Performance Package Applications
저자
by
Jhan, Jyun-De
;
Teng, Wen-Yu
;
Hung, Liang-Yih
;
Chen, Carl
;
Wang, Yu-Po
.
소스
2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :229-230 Apr, 2024
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7 . Conference
Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate
저자
by
Chen, Eric
;
Ye, Rick
;
Teng, Wen-Yu
;
Pei, Yu-Cheng
;
Wang, Yu-Po
.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1531-1535 May, 2023
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7 . Conference
Effect of Underfill Additive Agents on Crack Prevention in Large Fan-Out Multichip Module Packages
저자
by
Chen, Ching-Chia
;
Teng, Wen-Yu
;
Tsai, Fang Lin
;
Lee, Jackson
;
Hung, Liang Yih
, et al.
소스
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :477-480 Dec, 2022
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7 . Conference
Study of Parameter Tuning for the Curing Condition on ABF Type for Large FCBGA Package
저자
by
Ye, Rick
;
Chen, Eric
;
Teng, Wen-Yu
;
Kang, Andrew
;
Wang, Yu-Po
.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1987-1990 May, 2022
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7 . Conference
Investigation of Solder Resist Opening Uniformity on Flip Chip Substrate
저자
by
Ni, Yuan-Chang
;
Teng, Wen-Yu
;
Pai, Yu-Cheng
;
Chen, Carl
;
Wang, Yu-Po
.
소스
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :255-256 Apr, 2023
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7 . Conference
Stress and Reliability of Underfills in Heterogeneous Integration Fan-Out Multichip Module Packages
저자
by
Teng, Wen-Yu
;
Lee, Jackson
;
Hung, Liang-Yih
;
Jiang, Don-Son
;
Wang, Yu-Po
.
소스
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :235-236 Apr, 2023
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7 . Conference
Advanced Thermal Lid Attach Adhesive for High Performance Computing (HPC) Package
저자
by
Teng, Wen-Yu
;
Lee, Jackson
;
Tseng, Hsin-Ming
;
Hung, Liang-Yi
;
Jiang, Don Son
, et al.
소스
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :126-130 Dec, 2021
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7 . Conference
Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages
저자
by
Teng, Wen-Yu
;
Lee, Jackson
;
Tseng, Hsin-Ming
;
Hung, Liang Yih
;
Son Jiang, Don
, et al.
소스
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :225-226 May, 2022
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7 . Conference
Study of Measurement Index on the Polymer-to-Metal Direct-adhesion for Package Carrier
저자
by
Pai, Yu-Cheng
;
Yeh, Chan-Yu
;
Teng, Wen-Yu
;
Kang, Andrew
;
Wang, Yu-Po
.
소스
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :227-228 May, 2022
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