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1 . Academic Journal
Influence of Si wafer thinning processes on (sub)surface defects
저자
by
Inoue, Fumihiro
;
Jourdain, Anne
;
Peng, Lan
;
Phommahaxay, Alain
;
De Vos, Joeri
, et al.
소스
In
Applied Surface Science
15 May 2017 404:82-87
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7 . Academic Journal
Edge trimming for surface activated dielectric bonded wafers
저자
by
Inoue, Fumihiro
;
Jourdain, Anne
;
Visker, Jakob
;
Peng, Lan
;
Moeller, Berthold
, et al.
소스
In
Microelectronic Engineering
5 January 2017 167:10-16
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7 . Conference
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
저자
by
Phommahaxay, Alain
;
Kennes, Koen
;
Podpod, Arnita
;
Brems, Steven
;
Slabbekoorn, John
, et al.
소스
2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-8 Oct, 2019
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7 . Conference
Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding
저자
by
Inoue, Fumihiro
;
Phommahaxay, Alain
;
Podpod, Arnita
;
Suhard, Samuel
;
Hoshino, Hitoshi
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :437-445 May, 2019
Full Text (IEEE)
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7 . Conference
Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
저자
by
Podpod, Arnita
;
Phommahaxay, Alain
;
Bex, Pieter
;
Slabbekoorn, John
;
Bertheau, Julien
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :340-345 May, 2019
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7 . Conference
Direct Bonding of low Temperature Heterogeneous Dielectrics
저자
by
Iacovo, Serena
;
Peng, lan
;
Phommahaxay, Alain
;
Inoue, Fumihiro
;
Verdonck, Patrick
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2206-2212 May, 2019
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7 . Conference
Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
저자
by
Phommahaxay, Alain
;
Suhard, Samuel
;
Bex, Pieter
;
Iacovo, Serena
;
Slabbekoorn, John
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :607-613 May, 2019
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7 . Conference
Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations
저자
by
Bertheau, Julien
;
Inoue, Fumihiro
;
Phommahaxay, Alain
;
Peng, lan
;
Iacovo, Serena
, et al.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :86-91 May, 2018
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7 . Conference
Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up
저자
by
Phommahaxay, Alain
;
Podpod, Arnita
;
Slabbekoorn, John
;
Sleeckx, Erik
;
Beyer, Gerald
, et al.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :985-992 May, 2018
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7 . Conference
Thermal Compression Bonding: Understanding Heat Transfer by in Situ Measurements and Modeling
저자
by
Bex, Pieter
;
Wang, Teng
;
Lofrano, Melina
;
Cherman, Vladimir
;
Capuz, Giovanni
, et al.
소스
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :392-398 May, 2017
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