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1 . Academic Journal
Constitutive modeling of solder alloys for drop-impact applications
저자
by
Wong, E.H.
;
Chrisp, J.
;
Selvanayagam, C.S.
;
Seah, S.K.W.
.
소스
In
Microelectronics Reliability
December 2016 67:135-142
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6 . Academic Journal
Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency
저자
by
Wong, E.H.
;
Seah, S.K.W.
;
Caers, J.F.J.M.
;
Lai, Y.-S.
.
소스
In
International Journal of Fatigue
February 2014 59:43-49
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6 . Academic Journal
Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
저자
by
Seah, S.K.W.
;
Wong, E.H.
;
Shim, V.P.W.
.
소스
In
Scripta Materialia
2008 59(12):1239-1242
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5 . Conference
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints
저자
by
Wong, E.H.
;
Rajoo, R.
;
Mai, Y.W.
;
Seah, S.K.W.
;
Tsai, K.T.
, et al.
소스
Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :1202-1209 2005
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7 . Conference
Study of microvia failure under PCB flexing loads
저자
by
Seah, S.K.W.
;
Lim, C.T.
;
Tan, V.B.C.
;
Quah, S.E.
.
소스
53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :95-99 2003
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6 . Conference
Drop impact survey of portable electronic products
저자
by
Lim, C.T.
;
Ang, C.W.
;
Tan, L.B.
;
Seah, S.K.W.
;
Wong, E.H.
.
소스
53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :113-120 2003
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7 . Conference
Board level solder joint failures by static and dynamic loads
저자
by
Tan, L.B.
;
Seah, S.K.W.
;
Wong, E.H.
;
Xiaowu Zhang
;
Tan, V.B.C.
, et al.
소스
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :244-251 2003
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7 . Conference
Mechanical response of PCBs in portable electronic products during drop impact
저자
by
Seah, S.K.W.
;
Lim, C.T.
;
Wong, E.H.
;
Tan, V.B.C.
;
Shim, V.P.W.
.
소스
4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :120-125 2002
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7 . Conference
Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects
저자
by
Zhao, X. J.
;
Caers, J.F.J.M.
;
Wong, E.H.
;
Seah, S.K.W.
;
Driel, W.D.v.
, et al.
소스
2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :93-99 May, 2009
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7 . Conference
A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests
저자
by
Seah, S.K.W.
;
Wong, E.H.
;
Selvanayagam, C.S.
;
Caers, J.F.J.M.
;
Driel, W.D.v.
, et al.
소스
2008 10th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th. :1102-1107 Dec, 2008
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