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1 . Conference
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding
저자
by
Cheemalamarri, Hemanth Kumar
;
Sundaram, Arvind
;
Sandra, San
;
Van Nhat Anh, Tran
;
Chandra Rao, Bhesetti
, et al.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :803-808 May, 2024
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7 . Conference
Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
저자
by
Kumar, Mishra Dileep
;
Nagendra Sekhar, Vasarla
;
Rao, B.S.S. Chandra
;
Choong Chong, Ser
;
Rao, Vempati Srinivasa
.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :614-619 May, 2024
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7 . Conference
Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding
저자
by
Rao, B.S.S. Chandra
;
Kumar, Mishra Dileep
;
Sekhar, Vasarla Nagendra
;
Daniel, Ismael Cereno
;
Tippabhotla, Sasi Kumar
, et al.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :62-68 May, 2024
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7 . Conference
Cu/Dielectric hybrid bonding among Glass and Si
저자
by
Cheemalamarri, Hemanth Kumar
;
Sundaram, Arvind
;
Van Nhat Anh, Tran
;
Jae Ok, Yoo
;
Rao, Vempati Srinivasa
, et al.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1543-1547 May, 2024
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7 . Conference
Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications
저자
by
Sekhar, Vasarla Nagendra
;
Kumar, Mishra Dileep
;
Tippabhotla, Sasi Kumar
;
Rao, B. S. S. Chandra
;
Daniel, Ismael Cereno
, et al.
소스
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2024-2030 May, 2024
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7 . Conference
Defect evolution during through-silicon via copper electroplating and methods for robust void-free filling
저자
by
Van Nhat Anh, Tran
;
Venkataraman, Nandini
;
Tao, Meng
;
Ya-Ching, Tseng
;
Xiangyu, Wang
, et al.
소스
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1059-1062 Dec, 2023
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7 . Conference
Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding
저자
by
Cheemalamarri, Hemanth Kumar
;
Lir, Ji
;
Lee, Wen
;
Rao, Vempati Srinivasa
;
Singh, Navab
.
소스
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :493-497 Dec, 2023
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7 . Conference
Ultrathin New Dielectric Interlayer Layer - Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications
저자
by
Cheemalamarri, Hemanth Kumar
;
Lee Hou Jang, Steven
;
Miao, Ji Hong
;
V, Nandini
;
S, Chandra Rao B S
, et al.
소스
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :625-628 Dec, 2023
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7 . Conference
Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications
저자
by
Sekhar, Vasarla Nagendra
;
Fujiwara, Takenori
;
Araki, Hitoshi
;
Shoji, Yu
;
Jukei, Masaya
, et al.
소스
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :216-220 Dec, 2023
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7 . Conference
Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications
저자
by
Kumar, Mishra Dileep
;
Nagendra Sekhar, Vasarla
;
Choong, Chong Ser
;
Chandra Rao, B.S.S.
;
Chui, King-Jien
, et al.
소스
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :354-358 Dec, 2023
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