ieee transactions on components, packaging and manufacturing technology, components, packaging and manufacturing technology, ieee transactions on, ieee trans. compon., packag. manufact. technol. (13)
2011 ieee 61st electronic components & technology conference (ectc) (5)
proceedings electronic components & technology, 2005. ectc '05 (5)
proceedings electronic components and technology, 2005. ectc '05., electronic components and technology conference, 2005. proceedings. 55th, electronic components and technology (5)
2004 proceedings 54th electronic components & technology conference (ieee cat. no.04ch37546) (4)
2004 proceedings. 54th electronic components and technology conference (ieee cat. no.04ch37546), electronic components and technology conference, 2004. proceedings. 54th, electronic components and technology (4)
2007 proceedings 57th electronic components & technology conference (4)
2008 58th electronic components & technology conference (4)
2004 proceedings 9th international symposium on advanced packaging materials: processes, properties & interfaces (ieee cat. no.04th8742) (3)
2006 11th international symposium on advanced packaging materials: processes, properties and interface, advanced packaging materials: processes, properties and interface, 200611th international symposium on (3)
53rd electronic components and technology conference, 2003. proceedings., electronic components and technology conference, 2003. proceedings. 53rd (3)
9th international symposium on advanced packaging materials: processes, properties and interfaces (ieee cat. no.04th8742). 2004 proceedings., advanced packaging materials: processes, properties and interfaces, 2004. proceedings. 9th international symposium on, advanced packaging materials: processes, properties and interfaces (3)
ieee transactions on electromagnetic compatibility, electromagnetic compatibility, ieee transactions on, ieee trans. electromagn. compat. (3)
proceedings of the 53rd electronic components & technology conference, 2003 (3)
2006 11th international symposium on advanced packaging materials: processes, properties & interface (2)
2009 59th electronic components & technology conference (2)
2018 ieee 68th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2018 ieee 68th, ectc (2)
ieee nanotechnology magazine, nanotechnology magazine, ieee, ieee nanotechnology mag. (2)
ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. (2)
ieee transactions on electronics packaging manufacturing (2)
ieee transactions on magnetics, magnetics, ieee transactions on, ieee trans. magn. (2)
ieee transactions on microwave theory and techniques, microwave theory and techniques, ieee transactions on, ieee trans. microwave theory techn. (2)
proceedings of the 5th electronics packaging technology conference (eptc 2003) (2)
proceedings of the 5th electronics packaging technology conference (eptc 2003), electronics packaging technology, 2003 5th conference (eptc 2003), electronics packaging technology (2)
2005 international symposium on electromagnetic compatibility, 2005. emc 2005 (1)
2005 international symposium on electromagnetic compatibility, 2005. emc 2005., electromagnetic compatibility, 2005. emc 2005. 2005 international symposium on, electromagnetic compatibility (1)
2007 proceedings 57th electronic components and technology conference, electronic components and technology conference, 2007. ectc '07. proceedings. 57th (1)
2008 58th electronic components and technology conference, electronic components and technology conference, 2008. ectc 2008. 58th (1)
2009 ieee custom integrated circuits conference (1)
2014 ieee 64th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2014 ieee 64th (1)
2015 ieee 65th electronic components & technology conference (ectc) (1)
2015 ieee 65th electronic components and technology conference (ectc), electronic components and technology conference (ectc) , 2015 ieee 65th (1)
2023 fourth international symposium on 3d power electronics integration and manufacturing (3d-peim), 3d power electronics integration and manufacturing (3d-peim), 2023 fourth international symposium on (1)
52nd electronic components & technology conference 2002. (cat. no.02ch37345) (1)
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ieee antennas and wireless propagation letters, antennas and wireless propagation letters, ieee, antennas wirel. propag. lett. (1)
ieee microwave and wireless components letters, microwave and wireless components letters, ieee, ieee microw. wireless compon. lett. (1)
ieee microwave magazine, microwave magazine, ieee, ieee microwave (1)
ieee transactions on components and packaging technologies, components and packaging technologies, ieee transactions on, ieee trans. comp. packag. technol. (1)
ieee transactions on device and materials reliability, device and materials reliability, ieee transactions on, ieee trans. device mater. relib. (1)
ieee transactions on electronics packaging manufacturing, electronics packaging manufacturing, ieee transactions on, ieee trans. electron. packag. manufact. (1)
powder technology (1)
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proceedings of the sixth ieee cpmt conference on high density microsystem design & packaging & component failure analysis (hdp '04) (1)
proceedings of the sixth ieee cpmt conference on high density microsystem design and packaging and component failure analysis (hdp '04), high density microsystem design and packaging and component failure analysis, 2004. hdp '04. proceeding of the sixth ieee cpmt conference on, high density microsystem design and packaging and component failure analysis (1)
proceedings. international symposium on advanced packaging materials: processes, properties and interfaces, 2005., advanced packaging materials: processes, properties and interfaces, 2005. proceedings. international symposium on, advanced packaging materials: processes, properties and interfaces (1)