IEEE Transactions on Components Packaging and Manufacturing Technology Part B IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩ IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI) 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambéry, France. pp.1-4, ⟨10.1109/SaPIW.2019.8781655⟩ 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambery, France
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), May 2018, Brest, France. pp.1-4, ⟨10.1109/SaPIW.2018.8401670⟩