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1 . Academic Journal
Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints
저자
by
Qin, Hongbo
;
Bao, Hong
;
Zhang, Chaochao
;
Pan, Kailin
;
Zhao, Xiaohui
.
소스
In
Materials Characterization
September 2024 215
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7 . Academic Journal
Image defect classification of surface mount technology welding based on the improved ResNet model
저자
by
Zhang, Qiang
;
Zhang, Kaiyun
;
Pan, Kailin
;
Huang, Wei
.
소스
In
Journal of Engineering Research
June 2024 12(2):154-162
Full Text (ScienceDirect)
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6 . Report
Ring operads and symmetric bimonoidal categories
저자
by
Pan, Kailin
.
소스
Open Access (Arxiv)
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3 . Conference
Fatigue performance of Cu/Sn–3.0Ag–0.5Cu/Cu solder joints at different current densities
저자
by
Liu, Longgen
;
Wang, Bo
;
Li, Wangyun
;
Gong, Yubing
;
Pan, Kailin
.
소스
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :791-794 Dec, 2022
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7 . Conference
Analysis of the Effect of Hygrothermal Stress on Delamination of Plastic Sealed Devices
저자
by
Zhang, Qiang
;
Pan, Kailin
.
소스
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
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4 . Periodical
Design of protection resistor for a certain type of integrated power operational amplifier based on TRIZ theory
저자
by
Chen, Wanmi
;
Liu, Xiaogang
;
Sui, Xiaoming
;
Pan, Kailin
;
Xie, Weiwei
, et al.
소스
Proceedings of SPIE; April 2024, Vol. 13082 Issue: 1 p130821B-130821B-7, 1177397p
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7 . Academic Journal
Analysis of the Parallel Seam Welding Process by Developing a Directly Coupled Multiphysics Simulation Model.
저자
by
Lin, Yihao
;
Qin, Yang
;
Gong, Bilin
;
Yin, Can
;
Xia, Liang
, et al.
소스
Processes; Jan2024, Vol. 12 Issue 1, p78, 18p
Web of Science
Scopus
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7 . Conference
Simulation and Experimental Study of the Temperature Field of Solder Ball in the Nozzle during Laser Jet Solder Ball Bonding Process
저자
by
Li, Tong
;
Pan, Kailin
;
Tan, Zhengdong
;
Cai, Yunfeng
;
Teng, Tianjie
, et al.
소스
2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020
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7 . Academic Journal
Prediction of BGA solder joint array shape using improved Perzyna model and Anand model.
저자
by
Fang, Junxiong
;
Ran, Linjie
;
Huang, Wei
;
Pan, Kailin
;
Gong, Yubing
.
소스
Welding in the World; Dec2023, Vol. 67 Issue 12, p2765-2778, 14p
Web of Science
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7 . Conference
Study of the interaction energy at the composite interface between PDMS and functionalized Graphene using molecular dynamics simulations
저자
by
Fan, Kai
;
Pan, Kailin
;
Gong, Siming
;
Wang, Wenhui
;
Cheng, Hao
, et al.
소스
2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1735-1740 Aug, 2018
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