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1 . Academic Journal
Influence of tantalum/tantalum nitride barriers and caps on the high-temperature properties of copper metallization for wide-band gap applications
저자
by
Mardani, Shabnam
;
Norström, Hans
;
Smith, Ulf
;
Olsson, Jörgen
;
Zhang, Shi-Li
.
소스
In
Microelectronic Engineering
2 April 2015 137:37-42
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7 . Academic Journal
Electrical properties of Ag/Ta and Ag/TaN thin-films
저자
by
Mardani, Shabnam
;
Primetzhofer, Daniel
;
Liljeholm, Lina
;
Vallin, Örjan
;
Norström, Hans
, et al.
소스
In
Microelectronic Engineering
25 May 2014 120:257-261
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7 . Conference
Current gain and low-frequency noise of symmetric lateral bipolar junction transistors on SOI
저자
by
Hu, Qitao
;
Chen, Xi
;
Norstrom, Hans
;
Zeng, Shuangshuang
;
Liu, Yifei
, et al.
소스
2018 48th European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2018 48th European. :258-261 Sep, 2018
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7 . Academic Journal
Influence of SOI-generated stress on BiCMOS performance
저자
by
Johansson, Ted
;
Gunnar Malm, B.
;
Norström, Hans
;
Smith, Ulf
;
Östling, Mikael
.
소스
In
Solid State Electronics
2006 50(6):935-942
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7 . Conference
A +32.8 dBm LDMOS power amplifier for WLAN in 65 nm CMOS technology
저자
by
Johansson, Ted
;
Bengtsson, Olof
;
Lotfi, Sara
;
Vestling, Lars
;
Norstrom, Hans
, et al.
소스
2013 European Microwave Integrated Circuit Conference Microwave Integrated Circuits Conference (EuMIC), 2013 European. :53-56 Oct, 2013
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7 . Academic Journal
Implanted collector profile optimization in a SiGe HBT process
저자
by
Malm, Bengt Gunnar
;
Johansson, Ted
;
Arnborg, Torkel
;
Norström, Hans
;
Grahn, Jan V.
, et al.
소스
In
Solid State Electronics
2001 45(3):399-404
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7 . Academic Journal
Electromigration behavior of Cu metallization interfacing with Ta versus TaN at high temperatures.
저자
by
Mardani, Shabnam
;
Norström, Hans
;
Smith, Ulf
;
Gustavsson, Fredrik
;
Olsson, Jörgen
, et al.
소스
Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; Nov/Dec2016, Vol. 34 Issue 6, p060603-1-060603-5, 5p
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7 . Academic Journal
Massive Ta diffusion observed in Cu thin films but not in Ag counterparts.
저자
by
Mardani, Shabnam
;
Norström, Hans
;
Gustavsson, Fredrik
;
Nyberg, Tomas
;
Primetzhofer, Daniel
, et al.
소스
Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; Nov/Dec2016, Vol. 34 Issue 6, p060604-1-060604-6, 6p
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7 . Academic Journal
High-temperature Ta diffusion in the grain boundary of thin Cu films.
저자
by
Mardani, Shabnam
;
Norström, Hans
;
Smith, Ulf
;
Shi-Li Zhang
.
소스
Journal of Vacuum Science & Technology: Part B-Nanotechnology & Microelectronics; Jul/Aug2016, Vol. 34 Issue 4, p1-5, 5p
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6 . Academic Journal
Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer.
저자
by
Mardani, Shabnam
;
Vallin, Orjan
;
Wätjen, Jörn Timo
;
Norstrom, Hans
;
Olsson, Jörgen
, et al.
소스
Applied Physics Letters
. 8/18/2014, Vol. 105 Issue 7, p1-6. 6p. 3 Black and White Photographs, 3 Graphs.
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