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1 . Conference
Thermally Conductive Polymer Composites with Hexagonal Boron Nitride for Medical Device Thermal Management
저자
by
Duyen Do, Nu Bich
;
Imenes, Kristin
;
Aasmundtveit, Knut E.
;
Nguyen, Hoang-Vu
;
Andreassen, Erik
.
소스
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-8 Sep, 2023
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7 . Conference
Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres
저자
by
Huynh, Van Long
;
Aasmundtveit, Knut E.
;
Nguyen, Hoang-Vu
.
소스
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
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5 . Conference
Assembly of Ultra-Thin MEMS Device on Driver Chip Using Anisotropic Conductive Film
저자
by
Nguyen, Hoang-Vu
;
Aasmundtveit, Knut Eilif
.
소스
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
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4 . Conference
Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study
저자
by
Gonzalez, Lisette Hernandez
;
Aasmundveit, Knut E.
;
Nguyen, Hoang-Vu
.
소스
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2023 IMAPS Nordic Conference on. :1-4 Jun, 2023
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5 . Conference
Encapsulation of Biosensor for Stress Monitoring in Fish: A Study on Design and Material Evaluation
저자
by
Brathen, Hanna T.
;
Barskrind, Steffen
;
Kolstad, Anne Line Fredsvik
;
Honsvall, Birgitte
;
Nguyen, Hoang-Vu
.
소스
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2023 IMAPS Nordic Conference on. :1-5 Jun, 2023
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7 . Conference
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
저자
by
Zoschke, Kai
;
Manier, Charles Alix
;
Oppermann, Hermann
;
Meier, Dirk
;
Malik, Nishant
, et al.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1571-1578 May, 2023
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7 . Conference
Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials
저자
by
Nguyen, Hoang-Vu
;
Kuziora, Stephane Leonard
;
Aasmundtveit, Knut E.
.
소스
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :373-378 Sep, 2022
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5 . Conference
Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects
저자
by
Huynh, Van Long
;
Aasmundtveit, Knut Eilif
;
Nguyen, Hoang-Vu
.
소스
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :124-128 Sep, 2022
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5 . Conference
Vacuum Packaging of MEMS-based Infrared Detectors
저자
by
Roy, Avisek
;
Nguyen, Hoang-Vu
;
Xia, Hexin
;
Papatzacos, Phillip
;
Ohlckers, Per
, et al.
소스
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :410-415 Sep, 2022
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7 . Academic Journal
Enabling Low Pressure, Low Temperature, and Particle Control for Anisotropic Conductive Adhesives.
저자
by
Huynh, Van Long
;
Aasmundtveit, Knut E.
;
Nguyen, Hoang‐Vu
.
소스
Advanced Materials Technologies
. May2024, p1. 9p. 9 Illustrations, 2 Charts.
Scopus
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