japanese journal of applied physics (7)
applied physics express (3)
ieee transactions on magnetics (3)
journal of applied physics (3)
materials science in semiconductor processing (3)
2010 22nd international symposium on power semiconductor devices & ic's (ispsd), power semiconductor devices & ic's (ispsd), 2010 22nd international symposium on (2)
2019 6th international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2019 6th international workshop on (2)
applied physics express (apex) (2)
applied surface science (2)
ecs transactions (2)
mrs online proceedings library (2)
2011 ieee 23rd international symposium on power semiconductor devices and ics, power semiconductor devices and ics (ispsd), 2011 ieee 23rd international symposium on (1)
2013 1st international future energy electronics conference (ifeec) (1)
2013 1st international future energy electronics conference (ifeec), future energy electronics conference (ifeec), 2013 1st international (1)
2014 4th ieee international workshop on low temperature bonding for 3d integration (ltb-3d) (1)
2014 4th ieee international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2014 4th ieee international workshop on (1)
2014 international conference on electronics packaging (icep) (1)
2014 international conference on electronics packaging (icep), electronics packaging (icep), 2014 international conference on (1)
2015 international conference on electronic packaging & imaps all asia conference (icep-iaac) (1)
2015 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iacc), 2015 international conference on (1)
2016 ieee energy conversion congress and exposition (ecce), energy conversion congress and exposition (ecce), 2016 ieee (1)
2017 18th international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2017 18th international conference on (1)
2017 5th international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2017 5th international workshop on (1)
2018 international power electronics conference (ipec-niigata 2018 -ecce asia), power electronics conference (ipec-niigata 2018 -ecce asia), 2018 international (1)
advanced materials research (1)
bulletin of the chemical society of japan (1)
journal of advanced concrete technology (1)
proceedings of the 19th international symposium on power semiconductor devices and ic's, power semiconductor devices and ic's, 2007. ispsd '07. 19th international symposium on (1)