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1 . Academic Journal
Risk stratification of hemodynamically significant patent ductus arteriosus by clinical and genetic factors.
저자
by
Chen, Yu-Xi
;
Xiao, Tian-Tian
;
Chen, Hui-Yao
;
Chen, Xiang
;
Wang, Ya-Qiong
, et al.
소스
World Journal of Pediatrics; Dec2023, Vol. 19 Issue 12, p1192-1202, 11p
Web of Science
Scopus
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7 . Academic Journal
Investigation of pre-bending substrate design in packaging assembly of an IGBT power module
저자
by
Lee, Chang-Chun
;
Kao, Kuo-Shu
;
Lin, Leon
;
Chang, Jing-Yao
;
Leu, Fang-Jun
, et al.
소스
In
Microelectronic Engineering
25 May 2014 120:106-113
Full Text (ScienceDirect)
Web of Science
Scopus
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7 . Academic Journal
Balanced Translocation Disrupting JAG1 Identified by Optical Genomic Mapping in Suspected Alagille Syndrome.
저자
by
Zhang, Yi-Qiong
;
Gao, Peng-Fei
;
Yang, Jing-Min
;
Zhang, Jing
;
Lu, Yu-Lan
, et al.
소스
Human Mutation; 6/8/2023, p1-7, 7p
Web of Science
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7 . Academic Journal
Secondary genomic findings in the 2020 China Neonatal Genomes Project participants.
저자
by
Xiao, Hui
;
Zhang, Jian-Tao
;
Dong, Xin-Ran
;
Lu, Yu-Lan
;
Wu, Bing-Bing
, et al.
소스
World Journal of Pediatrics; Oct2022, Vol. 18 Issue 10, p687-694, 8p
Web of Science
Scopus
JCR 저널정보
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7 . Conference
Process feasibility of a novel dielectric material in a chip embedded, coreless and asymmetrically built-up structure
저자
by
Hung, Yin-po
;
Huang, Yu-wei
;
Cheng, Ren-shin
;
Leu, Fang-jun
;
Fun, Su-Yu
, et al.
소스
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :275-278 Oct, 2013
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7 . Conference
The first MIT 600 V/450 a IGBT module for EV/HEV applications
저자
by
Kao, Kuo-Shu
;
Leu, Fang-Jun
;
Chang, Jing-Yao
;
Fan, Su-Yu
;
Lu, Yu-Lan
, et al.
소스
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :140-143 Oct, 2013
Full Text (IEEE)
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7 . Conference
Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film
저자
by
Huang, Yu-Wei
;
Lin, Yu-Min
;
Zhan, Chau-Jie
;
Lu, Su-Tsai
;
Huang, Shin-Yi
, et al.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :71-76 May, 2013
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7 . Conference
Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection
저자
by
Juang, Jing-Ye
;
Huang, Shin-Yi
;
Zhan, Chau-Jie
;
Lin, Yu-Min
;
Huang, Yu-Wei
, et al.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :653-659 May, 2013
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7 . Conference
Development of micro-bump-bonded processes for 3DIC stacking with high throughput
저자
by
Juang, Jing-Ye
;
Lu, Su-Tsai
;
Chung, Su-Ching
;
Cheng, Su-Mei
;
Lu, Yu-Lan
, et al.
소스
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :366-369 Oct, 2011
Full Text (IEEE)
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7 . Conference
Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive
저자
by
Lin, Yu-Min
;
Zhan, Chau-Jie
;
Huang, Yu-wei
;
Chung, Su-Ching
;
Fan, Chia-Wen
, et al.
소스
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :478-481 Oct, 2011
Full Text (IEEE)
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