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1 . Academic Journal
High-sensitivity MEMS force and acceleration sensor based on graphene-induced non-radiative transition
저자
by
Li, Guanghui
;
Liu, Fengman
;
Yang, Shengyi
;
Liu, Jiang-Tao
;
Li, Weimin
, et al.
소스
In
Carbon
5 June 2023 209
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7 . Academic Journal
Efficient and scalable edge coupler based on silica planar lightwave circuits and lithium niobate thin films
저자
by
Yang, Peng
;
Sun, Siwei
;
Xue, Haiyun
;
Zheng, Qi
;
He, Huimin
, et al.
소스
In
Optics and Laser Technology
February 2023 158 Part A
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7 . Conference
Simulation and Optimization of the high-speed transmission structure in organic-packaged coherent optical transceiver
저자
by
Zhao, Jinteng
;
He, Huimin
;
Xue, Haiyun
;
Zheng, Qi
;
Yuan, Jian
, et al.
소스
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
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7 . Conference
Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package
저자
by
Han, Shunfeng
;
Li, Dejian
;
Feng, Xi
;
Guan, Yuan
;
Li, Bofu
, et al.
소스
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
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7 . Conference
A 4×52 Gbps PAM4 WDM Transmitter with Silicon Photonics Microring Modulator
저자
by
Cao, Rui
;
He, Huimin
;
Liu, Fengman
;
Cao, Liqiang
.
소스
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022
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6 . Academic Journal
High-Bandwidth Lumped Mach-Zehnder Modulators Based on Thin-Film Lithium Niobate.
저자
by
Yang, Peng
;
Sun, Siwei
;
Zhang, Yuqiang
;
Cao, Rui
;
He, Huimin
, et al.
소스
Photonics; May2024, Vol. 11 Issue 5, p399, 12p
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7 . Report
High-sensitivity graphene MEMS force and acceleration sensor based on graphene-induced non-radiative transition
저자
by
Lia, Guanghui
;
Liu, Fengman
;
Yanga, Shengyi
;
Liu, Jiang-Tao
;
Li, Weimin
, et al.
소스
Open Access (Arxiv)
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7 . Academic Journal
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
저자
by
Chen, Cheng
;
Hou, Fengze
;
Liu, Fengman
;
She, Qian
;
Cao, Liqiang
, et al.
소스
In
Microelectronics Reliability
December 2017 79:38-47
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7 . Conference
The multi-dimension co-design for the package of the high-speed multi-function chip
저자
by
Guan, Yuan
;
Wang, Yubo
;
Li, Dejian
;
Han, Shunfeng
;
Li, Bofu
, et al.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021
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7 . Conference
Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules
저자
by
Zheng, Qi
;
He, Huimin
;
Bai, Lijuan
;
Wang, Yubo
;
Li, Dejian
, et al.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021
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