공지
도서관 자료실 휴실 안내(10. 1., 10. 3., 10. 9.)
2024학년도 도서관 전자정보박람회 경품 추첨 결과 및 수령 안내
2024학년도 2학기 도서관 정보활용교육 안내
학술 생성형 AI 서비스 「tlooto」 시범 운영 안내
원문복사·상호대차 이용안내
이전
다음
Close today
공지사항 닫기
DAU Library
Central Library
Dong-A University
LOGIN
Off-Campus Access
OFF
KO
Open the search box
Search"
Search
All
Library Catalog
eJournals
Databases
e-Learning
e-Learning
INSPIRE
KOCW
Overseas OCW/MOOC List
eBooks
Collections
New Arrivals(Subject)
Popular Books
Recommendations
DAU Reading List
Book Gallery
Research book
Research Support
Journal Evaluation
Subject Guides
Plagiarism Prevention
Plagiarism Prevention
Research Ethics
References Management
Thesis Submission
Document Delivery Service/Interlibrary Loan
Document Delivery Service/Interlibrary Loan
Medicine, Nursing(Request_Journal)
Medicine, Nursing(Request_Thesis)
DDS/ILL – Request list
Library Instruction
Library Instruction Guide
Library Instruction Request
Group Instruction Request
Libaray Services
Use Using Materials
Borrow/Renew/Return
Inter-Campus Loan
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
Facilities
Group Study Room
Group Study Room Request
Reading Room
Visit Other Libraries(Data)
Visit Other Libraries for Material Use
Visit Other Libraries Request(Data)
Request History (Material Use)
Visit Other Libraries(Reading Room)
Visit Other Libraries Guide(Reading Room)
Visit Other Libraries Request(Reading Room)
Request History (Reading Room)
User Guide
Undergraduates
Graduates students
Faculty/Staff
Special member
Etc.
Mobile Service
Mobile Web
Mobile Seat Allocation
Mobile ID Card
WiFi
Off-Campus Access
Find Services
About our Library
Overview
Overview
History
Status
Regulations
Organization/Staff
Library Hours
Floor Guide
Donations
How to Donate
List
Cyber Memorial Collection
Directions
Community
Notice
Notice(Datebases)
Q&A
Q&A
FAQ
Book Reviews
Best Reviews
Program Feedback
Forms
Error Inquiry
My Library
Borrow/Renew
Borrow/Renew
History
Inter-Campus Loan List
My Request List
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
DDS – Request List
Group Study Room
Library Instruction
My Shelf
My Book Reviews
Personal Information
Profile
Notice
Quick Menu
My Shelf
Error Inquiry
메뉴 전체보기
eArticles
Home
>
Search
>
eArticles
>
All
Library Catalog
eArticles
eJournals
전체
ISSN
논문 제목
Journal Title
저자
엡스코 구버전 바로가기
발행년도
-
(ex : 2010-2015)
'
학술논문
' 에서의 검색결과
95
건 | List
1~10
Select All
Relevance
Date Newest
Date Oldest
5
10
20
30
40
50
E-Mail
EndNote
RefWorks
1 . Academic Journal
Low-temperature copper sinter-joining technology for power electronics packaging: A review
저자
by
Wang, Yujian
;
Xu, Dou
;
Yan, Haidong
;
Li, Cai-Fu
;
Chen, Chuantong
, et al.
소스
In
Journal of Materials Processing Tech.
November 2024 332
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Academic Journal
The effect of finish layer on the interfacial cracking failure of Au[sbnd]Si bonding
저자
by
Gao, Li-Yin
;
Wen, Jian
;
Li, Cai-Fu
;
Chen, Chunhuan
;
Liu, Zhi-Quan
.
소스
In
Engineering Failure Analysis
September 2020 115
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Academic Journal
Effect of polyol synthesis on sintering of microsized Ag particles
저자
by
Yeom, Jeyun
;
Zhang, Zheng
;
Li, Cai-Fu
;
Suganuma, Katsuaki
.
소스
In
Microelectronics Reliability
September 2019 100-101
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
6 . Academic Journal
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
저자
by
Li, Qi-hai
;
Li, Cai-Fu
;
Zhang, Wei
;
Chen, Wei-wei
;
Liu, Zhi-Quan
.
소스
In
Microelectronics Reliability
August 2019 99:12-18
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Effects of Sintering Parameters on Silver Joints Prepared with Micron Silver Paste for Power Electronics
저자
by
Chen, Zehao
;
Huang, Shijun
;
Li, Cai-Fu
.
소스
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
5 . Academic Journal
Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
저자
by
Gao, Yue
;
Li, Wanli
;
Chen, Chuantong
;
Zhang, Hao
;
Jiu, Jinting
, et al.
소스
In
Materials & Design
15 December 2018 160:1265-1272
Full Text (ScienceDirect)
Full Text (ScienceDirect O/A)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Academic Journal
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
저자
by
Gao, Li-Yin
;
Zhang, Hao
;
Li, Cai-Fu
;
Guo, Jingdong
;
Liu, Zhi-Quan
.
소스
In
Journal of Materials Science & Technology
August 2018 34(8):1305-1314
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Academic Journal
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
저자
by
Gao, Li-Yin
;
Li, Cai-Fu
;
Wan, Peng
;
Zhang, Hao
;
Liu, Zhi-Quan
.
소스
In
Journal of Alloys and Compounds
30 March 2018 739:632-642
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Academic Journal
Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability
저자
by
Li, Wanli
;
Li, Lingying
;
Gao, Yue
;
Hu, Dawei
;
Li, Cai-Fu
, et al.
소스
In
Journal of Alloys and Compounds
25 January 2018 732:240-247
Full Text (ScienceDirect)
Web of Science
Scopus
JCR 저널정보
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Micron-Scale Silver Flake Paste Sintering Without Pressure for Power Electronic Die Attachment
저자
by
Huang, Shijun
;
Luo, Ruidong
;
Wu, Zhen
;
Li, Cai-Fu
.
소스
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
1
2
3
…
10
Next
메일 발송
로그인후 이용해주세요.
이동하기
Full menu
Close full menu
Search
All
Library Catalog
eJournals
Databases
e-Learning
e-Learning
INSPIRE
KOCW
Overseas OCW/MOOC List
eBooks
Collections
New Arrivals(Subject)
Popular Books
Recommendations
DAU Reading List
Book Gallery
Research book
Research Support
Journal Evaluation
Subject Guides
Plagiarism Prevention
Plagiarism Prevention
Research Ethics
References Management
Thesis Submission
Document Delivery Service/Interlibrary Loan
Document Delivery Service/Interlibrary Loan
Medicine, Nursing(Request_Journal)
Medicine, Nursing(Request_Thesis)
DDS/ILL – Request list
Library Instruction
Library Instruction Guide
Library Instruction Request
Group Instruction Request
Libaray Services
Use Using Materials
Borrow/Renew/Return
Inter-Campus Loan
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
Facilities
Group Study Room
Group Study Room Request
Reading Room
Visit Other Libraries(Data)
Visit Other Libraries for Material Use
Visit Other Libraries Request(Data)
Request History (Material Use)
Visit Other Libraries(Reading Room)
Visit Other Libraries Guide(Reading Room)
Visit Other Libraries Request(Reading Room)
Request History (Reading Room)
User Guide
Undergraduates
Graduates students
Faculty/Staff
Special member
Etc.
Mobile Service
Mobile Web
Mobile Seat Allocation
Mobile ID Card
WiFi
Off-Campus Access
Find Services
About our Library
Overview
Overview
History
Status
Regulations
Organization/Staff
Library Hours
Floor Guide
Donations
How to Donate
List
Cyber Memorial Collection
Directions
Community
Notice
Notice(Datebases)
Q&A
Q&A
FAQ
Book Reviews
Best Reviews
Program Feedback
Forms
Error Inquiry
My Library
Borrow/Renew
Borrow/Renew
History
Inter-Campus Loan List
My Request List
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
DDS – Request List
Group Study Room
Library Instruction
My Shelf
My Book Reviews
Personal Information
Profile
Notice