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1 . Academic Journal
Investigation of pre-bending substrate design in packaging assembly of an IGBT power module
저자
by
Lee, Chang-Chun
;
Kao, Kuo-Shu
;
Lin, Leon
;
Chang, Jing-Yao
;
Leu, Fang-Jun
, et al.
소스
In
Microelectronic Engineering
25 May 2014 120:106-113
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7 . Conference
Characteristics of 600 V / 450 A IGBT module assembled by Ag sintering technology
저자
by
Chang, Jing-Yao
;
Su-Yu Fun
;
Leu, Fang-Jun
;
Kao, Kuo-Shu
;
Chih-Ming Tzeng
, et al.
소스
2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :96-100 Apr, 2014
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7 . Conference
Process feasibility of a novel dielectric material in a chip embedded, coreless and asymmetrically built-up structure
저자
by
Hung, Yin-po
;
Huang, Yu-wei
;
Cheng, Ren-shin
;
Leu, Fang-jun
;
Fun, Su-Yu
, et al.
소스
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :275-278 Oct, 2013
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7 . Conference
The first MIT 600 V/450 a IGBT module for EV/HEV applications
저자
by
Kao, Kuo-Shu
;
Leu, Fang-Jun
;
Chang, Jing-Yao
;
Fan, Su-Yu
;
Lu, Yu-Lan
, et al.
소스
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :140-143 Oct, 2013
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7 . Conference
Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding
저자
by
Chang, Tao-Chih
;
Cheng, Ren-Shin
;
Kao, Kuo-Shu
;
Li, Wei
;
Lee, Ching-Kuan
, et al.
소스
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :419-422 Oct, 2011
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7 . Conference
Processing characteristics and reliability of embedded DDR2 memory chips
저자
by
Hung, Yin-Po
;
Chang, Tao-Chih
;
Lee, Ching-Kuan
;
Lee, Yuan-Chang
;
Chang, Jing-Yao
, et al.
소스
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
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7 . Conference
Reliability assessment of the 20 um pitch micro-joints within a 3DIC assembly under various environments
저자
by
Huang, Shin-Yi
;
Chang, Tao-Chih
;
Cheng, Ren-Shin
;
Chang, Jing-Yao
;
Leu, Fang-Jun
, et al.
소스
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
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7 . Conference
Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application
저자
by
Chien, Chien-Wei
;
Shen, Li-Cheng
;
Chang, Tao-Chih
;
Chang, Chin-Yao
;
Leu, Fang-Jun
, et al.
소스
2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :305-310 Jun, 2007
Full Text (IEEE)
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7 . Conference
Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips
저자
by
Shen, Li-Cheng
;
Chien, Chien-Wei
;
Chang, Tao-Chih
;
Yang, Tsung-Fu
;
Chen, Wen-Chih
, et al.
소스
2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :580-584 Jun, 2007
Full Text (IEEE)
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7 . Academic Journal
MULTICHANNEL PLANAR MICROELECTRODE ARRAY FOR SOMATIC MAPPING IN RATS.
저자
by
Shaw, Fu-Zen
;
Yang, Tsung-Fu
;
Huang, Chien-Chun
;
Yeh, Keng-Hung
;
Chang, Tao-Chih
, et al.
소스
Biomedical Engineering: Applications, Basis & Communications; Dec2011, Vol. 23 Issue 6, p501-508, 8p
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