공지
도서관 자료실 휴실 안내(10. 1., 10. 3., 10. 9.)
2024학년도 도서관 전자정보박람회 경품 추첨 결과 및 수령 안내
2024학년도 2학기 도서관 정보활용교육 안내
학술 생성형 AI 서비스 「tlooto」 시범 운영 안내
원문복사·상호대차 이용안내
이전
다음
Close today
공지사항 닫기
DAU Library
Central Library
Dong-A University
LOGIN
Off-Campus Access
OFF
KO
Open the search box
Search"
Search
All
Library Catalog
eJournals
Databases
e-Learning
e-Learning
INSPIRE
KOCW
Overseas OCW/MOOC List
eBooks
Collections
New Arrivals(Subject)
Popular Books
Recommendations
DAU Reading List
Book Gallery
Research book
Research Support
Journal Evaluation
Subject Guides
Plagiarism Prevention
Plagiarism Prevention
Research Ethics
References Management
Thesis Submission
Document Delivery Service/Interlibrary Loan
Document Delivery Service/Interlibrary Loan
Medicine, Nursing(Request_Journal)
Medicine, Nursing(Request_Thesis)
DDS/ILL – Request list
Library Instruction
Library Instruction Guide
Library Instruction Request
Group Instruction Request
Libaray Services
Use Using Materials
Borrow/Renew/Return
Inter-Campus Loan
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
Facilities
Group Study Room
Group Study Room Request
Reading Room
Visit Other Libraries(Data)
Visit Other Libraries for Material Use
Visit Other Libraries Request(Data)
Request History (Material Use)
Visit Other Libraries(Reading Room)
Visit Other Libraries Guide(Reading Room)
Visit Other Libraries Request(Reading Room)
Request History (Reading Room)
User Guide
Undergraduates
Graduates students
Faculty/Staff
Special member
Etc.
Mobile Service
Mobile Web
Mobile Seat Allocation
Mobile ID Card
WiFi
Off-Campus Access
Find Services
About our Library
Overview
Overview
History
Status
Regulations
Organization/Staff
Library Hours
Floor Guide
Donations
How to Donate
List
Cyber Memorial Collection
Directions
Community
Notice
Notice(Datebases)
Q&A
Q&A
FAQ
Book Reviews
Best Reviews
Program Feedback
Forms
Error Inquiry
My Library
Borrow/Renew
Borrow/Renew
History
Inter-Campus Loan List
My Request List
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
DDS – Request List
Group Study Room
Library Instruction
My Shelf
My Book Reviews
Personal Information
Profile
Notice
Quick Menu
My Shelf
Error Inquiry
메뉴 전체보기
eArticles
Home
>
Search
>
eArticles
>
All
Library Catalog
eArticles
eJournals
전체
ISSN
논문 제목
Journal Title
저자
엡스코 구버전 바로가기
발행년도
-
(ex : 2010-2015)
'
학술논문
' 에서의 검색결과
83
건 | List
1~10
Select All
Relevance
Date Newest
Date Oldest
5
10
20
30
40
50
E-Mail
EndNote
RefWorks
1 . Conference
Development of a no Reflow Cu Pillar Bump to Improve Chip/Package Interactions (CPI) Process and Reliability Performance
저자
by
Kuo, Kuei Hsiao
;
Wang, Jiunn Jie
;
Wang, Yen Neng
;
Chien, Feng Lung
;
Lee, Rick
.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1635-1640 May, 2019
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package
저자
by
Kuo, Kuei Hsiao
;
Chen, Austin
;
Wang, Yen Neng
;
Wang, Jiunn Jie
;
Chang, Jovi
, et al.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :771-776 May, 2018
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
The Comparative Study to Enhance Board Level Reliability Performance of Wafer Level Package At 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology
저자
by
Kuo, Kuei Hsiao
;
Ting, Yi Sin
;
Weng, Chui Feng
;
Chien, Feng Lung
;
Wan, Katch
, et al.
소스
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1204-1209 May, 2017
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Periodical
Backfires.
저자
by
Lee, Rick
;
Kramer, Tom
;
Groesbeck, Mike
;
Whitman, Rich
;
Nate
, et al.
소스
Car & Driver
. Jul/Aug2023, Vol. 69 Issue 1, p5-11. 6p. 5 Color Photographs.
Find it @ DONGA
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Studying the Effect of Stackup Structure of Large Die Size Fan-In Wafer Level Package at 0.35 mm Pitch With Varying Ball Alloy to Enhance Board Level Reliability Performance
저자
by
Kuo, Kuei Hsiao
;
Chiang, Jerry
;
Chang, Kui
;
Shu, Jack
;
Chien, F. L.
, et al.
소스
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :140-146 May, 2016
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Effects of Reflow Cooling Rate on the Growth of Ag3Sn Platelets and Deformation of Solder Balls
저자
by
Lin, Chi Pu
;
Wan, Katch
;
Sun, Tommy
;
Chen, Chih-Ming
;
Lee, Rick
.
소스
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :2075-2081 May, 2016
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
The impact and performance of electromigration on fine pitch Cu pillar with different bump structure for flip chip packaging
저자
by
Kuo, Kuei Hsiao
;
Mao, Cindy
;
Wang, Katch
;
Lee, Jason
;
Chien, F.L.
, et al.
소스
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :626-631 May, 2015
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Electromigration performance of Cu pillar bump for flip chip packaging with bump on trace by using thermal compression bonding
저자
by
Frank, Kuei Hsiao Kuo
;
Lee, Jason
;
Chien, F. L.
;
Lee, Rick
;
Mao, Cindy
, et al.
소스
2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :56-61 May, 2014
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Electromigration performance of printed Sn0.7Cu bumps with immersion tin surface finishing for flip chip applications
저자
by
Kuo, Kuei Hsiao
;
Lee, Jason
;
Chen, Stan
;
Chien, F. L.
;
Lee, Rick
, et al.
소스
2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :698-702 May, 2012
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
7 . Conference
Low-cost and fine-pitch micro-ball mounting technology for WLCSP
저자
by
Lin, Y. H.
;
Kuo, Frank
;
Chen, Y. F.
;
Ho, C. S.
;
Lai, J. Y.
, et al.
소스
2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :953-958 May, 2012
Full Text (IEEE)
요약보기
Export
E-Mail
EndNote
RefWorks
1
2
3
…
9
Next
메일 발송
로그인후 이용해주세요.
이동하기
Full menu
Close full menu
Search
All
Library Catalog
eJournals
Databases
e-Learning
e-Learning
INSPIRE
KOCW
Overseas OCW/MOOC List
eBooks
Collections
New Arrivals(Subject)
Popular Books
Recommendations
DAU Reading List
Book Gallery
Research book
Research Support
Journal Evaluation
Subject Guides
Plagiarism Prevention
Plagiarism Prevention
Research Ethics
References Management
Thesis Submission
Document Delivery Service/Interlibrary Loan
Document Delivery Service/Interlibrary Loan
Medicine, Nursing(Request_Journal)
Medicine, Nursing(Request_Thesis)
DDS/ILL – Request list
Library Instruction
Library Instruction Guide
Library Instruction Request
Group Instruction Request
Libaray Services
Use Using Materials
Borrow/Renew/Return
Inter-Campus Loan
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
Facilities
Group Study Room
Group Study Room Request
Reading Room
Visit Other Libraries(Data)
Visit Other Libraries for Material Use
Visit Other Libraries Request(Data)
Request History (Material Use)
Visit Other Libraries(Reading Room)
Visit Other Libraries Guide(Reading Room)
Visit Other Libraries Request(Reading Room)
Request History (Reading Room)
User Guide
Undergraduates
Graduates students
Faculty/Staff
Special member
Etc.
Mobile Service
Mobile Web
Mobile Seat Allocation
Mobile ID Card
WiFi
Off-Campus Access
Find Services
About our Library
Overview
Overview
History
Status
Regulations
Organization/Staff
Library Hours
Floor Guide
Donations
How to Donate
List
Cyber Memorial Collection
Directions
Community
Notice
Notice(Datebases)
Q&A
Q&A
FAQ
Book Reviews
Best Reviews
Program Feedback
Forms
Error Inquiry
My Library
Borrow/Renew
Borrow/Renew
History
Inter-Campus Loan List
My Request List
Purchase Request
Closed Stack Request
Priority Cataloging Book Request
Missing Book Request
DDS – Request List
Group Study Room
Library Instruction
My Shelf
My Book Reviews
Personal Information
Profile
Notice