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1 . Report
Quantum crosstalk cancellation for fast entangling gates and improved multi-qubit performance
저자
by
Wei, K. X.
;
Magesan, E.
;
Lauer, I.
;
Srinivasan, S.
;
Bogorin, D. F.
, et al.
소스
Phys. Rev. Lett. 129, 060501 (2022)
Open Access (Arxiv)
Find it @ DONGA
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7 . Conference
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
저자
by
Filippi, R.G.
;
McGrath, J.F.
;
Shaw, T.M.
;
Murray, C.E.
;
Rathore, H.S.
, et al.
소스
2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :61-67 2004
Full Text (IEEE)
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7 . Conference
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
저자
by
Edelstein, D.
;
Rathore, H.
;
Davis, C.
;
Clevenger, L.
;
Cowley, A.
, et al.
소스
2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :316-319 2004
Full Text (IEEE)
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7 . Conference
Vertical channel devices enabled by through silicon via (TSV) technologies
저자
by
Kothandaraman, C.
;
Rosenblatt, S.
;
Safran, J.
;
Oldiges, P.
;
Kulkarni-Kerber, P.
, et al.
소스
2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :9.6.1-9.6.4 Dec, 2016
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7 . Conference
Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology
저자
by
Landers, W.
;
Edelstein, D.
;
Clevenger, L.
;
Das, C.
;
Yang, C.-C.
, et al.
소스
Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :108-110 2004
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7 . Conference
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
저자
by
Edelstein, D.
;
Davis, C.
;
Clevenger, L.
;
Yoon, M.
;
Cowley, A.
, et al.
소스
Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :214-216 2004
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7 . Conference
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
저자
by
Farooq, M. G.
;
Rosa, G. La
;
Chen, F.
;
Periasamy, P.
;
Graves-Abe, T. L.
, et al.
소스
2015 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2015 IEEE International. :4C.1.1-4C.1.8 Apr, 2015
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7 . Conference
A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology
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by
Sankaran, S.
;
Arai, S.
;
Augur, R.
;
Beck, M.
;
Biery, G.
, et al.
소스
2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006
Full Text (IEEE)
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7 . Conference
High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography
저자
by
Agnello, P.
;
Ivers, T.
;
Warm, C.
;
Wise, R.
;
Wachnik, R.
, et al.
소스
2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006
Full Text (IEEE)
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7 . Conference
Through silicon via (TSV) effects on devices in close proximity - the role of mobile ion penetration - characterization and mitigation
저자
by
Kothandaraman, C.
;
Cohen, S.
;
Parks, C.
;
Golz, J.
;
Tunga, K.
, et al.
소스
2014 IEEE International Electron Devices Meeting Electron Devices Meeting (IEDM), 2014 IEEE International. :14.6.1-14.6.3 Dec, 2014
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