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1 . Academic Journal
Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications
저자
by
Sun, Zhijian
;
Liu, Yifan
;
Wong, Ryan
;
Yu, Michael
;
Li, Jiaxiong
, et al.
소스
In
Composites Science and Technology
10 November 2022 230 Part 1
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7 . Academic Journal
A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications
저자
by
Sun, Zhijian
;
Li, Jiaxiong
;
Yu, Michael
;
Kathaperumal, Mohanalingam
;
Wong, Ching-Ping
.
소스
In
Chemical Engineering Journal
15 October 2022 446 Part 5
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7 . Academic Journal
Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers
저자
by
Sun, Zhijian
;
Wong, Ryan
;
Yu, Michael
;
Li, Jiaxiong
;
Zhang, Mingyue
, et al.
소스
In
Chemical Engineering Journal
1 July 2022 439
Full Text (ScienceDirect)
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7 . Conference
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
저자
by
Vanna-Iampikul, Pruek
;
Zhu, Lingjun
;
Erdogan, Serhat
;
Kathaperumal, Mohanalingam
;
Agarwal, Ravi
, et al.
소스
2023 60th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2023 60th ACM/IEEE. :1-6 Jul, 2023
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7 . Conference
Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates
저자
by
Nimbalkar, Pratik
;
Aguebor, Mercy
;
Kathaperumal, Mohanalingam
;
Swaminathan, Madhavan
;
Tummala, Rao
.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1603-1608 May, 2023
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7 . Conference
Demonstration of Eight Metal Layer Redistribution on Glass Substrate with Fine Features and Microvia
저자
by
Blancher, Christopher
;
Kathaperumal, Mohanalingam
;
Liu, Fuhan
;
Swaminathan, Madhavan
.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1744-1748 May, 2023
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6 . Conference
Maskless Lithography for High-Density Package Redistribution Layers
저자
by
Murali, Prahalad
;
Nimbalkar, Pratik
;
Kathaperumal, Mohanalingam
;
Losego, Mark D.
;
Tummala, Rao
, et al.
소스
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :147-151 May, 2023
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7 . Conference
Integrated and Miniaturized Quasi Yagi D-Band Antenna in Glass Interposer
저자
by
Erdogan, Serhat
;
Moon, Kyoung-Sik Jack
;
Kathaperumal, Mohanalingam
;
Swaminathan, Madhavan
.
소스
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 International Microwave Symposium - IMS 2022, 2022 IEEE/MTT-S. :687-690 Jun, 2022
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6 . Conference
Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation
저자
by
Sun, Zhijian
;
Yu, Michael
;
Li, Jiaxiong
;
Moran, Macleary
;
Kathaperumal, Mohanalingam
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1282-1286 May, 2022
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7 . Conference
Novel zero side-etch process for
저자
by
Nimbalkar, Pratik
;
Bhaskar, Pragna
;
Blancher, Christopher
;
Kathaperumal, Mohanalingam
;
Swaminathan, Madhavan
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2168-2173 May, 2022
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