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1 . Conference
Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
저자
by
Zoschke, K.
;
Manier, C.-A.
;
Wilke, M.
;
Jurgensen, N.
;
Oppermann, H.
, et al.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1500-1507 May, 2013
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7 . Conference
Copper filling of TSVs for interposer applications
저자
by
Jurgensen, N.
;
Huynh, Q. H.
;
Engelmann, G.
;
Ngo, H.-D.
;
Ehrmann, O.
, et al.
소스
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :759-763 Dec, 2012
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7 . Conference
TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
저자
by
Zoschke, K.
;
Wolf, J.
;
Lopper, C.
;
Kuna, I.
;
Jurgensen, N.
, et al.
소스
2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :836-843 May, 2011
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7 . Conference
Silicon-interposer with high density Cu-filled TSVs
저자
by
Wieland, R.
;
Zoschke, K.
;
Jurgensen, N.
;
Merkel, R.
;
Nebrich, L.
, et al.
소스
2010 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2010 IEEE International. :1-4 Nov, 2010
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7 . Conference
Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
저자
by
Zoschke, K.
;
Wegner, M.
;
Wilke, M.
;
Jurgensen, N.
;
Lopper, C.
, et al.
소스
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1385-1392 Jun, 2010
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7 . Academic Journal
Comparison of biodegradable substrates for printed organic electronic devices.
저자
by
Morfa, A.
;
Rödlmeier, T.
;
Jürgensen, N.
;
Stolz, S.
;
Hernandez-Sosa, G.
.
소스
Cellulose; Dec2016, Vol. 23 Issue 6, p3809-3817, 9p
Web of Science
Scopus
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7 . Conference
High aspect ratio TSV copper filling with different seed layers.
저자
by
Wolf, M.J.
;
Dretschkow, T.
;
Wunderle, B.
;
Jurgensen, N.
;
Engelmann, G.
, et al.
소스
2008 58th Electronic Components & Technology Conference; 2008, p563-570, 8p
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7 . Periodical
School-based intervention for improving the oral health of children in southern Thailand.
저자
by
Petersen, P. E.
;
Hunsrisakhun, J.
;
Thearmontree, A.
;
Pithpomchaiyaku, S.
;
Hintao, J.
, et al.
소스
Community Dental Health; Mar2015, Vol. 32 Issue 1, p44-50, 7p
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7 . Periodical
Oral health behaviour of urban and semi-urban schoolchildren in the Lao PDR.
저자
by
Jürgensen, N.
;
Petersen, P. E.
.
소스
Community Dental Health; Dec2011, Vol. 28 Issue 4, p280-285, 6p, 4 Charts
Web of Science
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4 . Academic Journal
Promoting oral health of children through schools - Results from a WHO global survey 2012
저자
by
Jurgensen, N.
;
Petersen, P. E.
.
소스
COMMUNITY DENTAL HEALTH
; DEC 2013, 30 4, p204-p218, 15p.
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