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1 . Conference
Effect of Underfill Additive Agents on Crack Prevention in Large Fan-Out Multichip Module Packages
저자
by
Chen, Ching-Chia
;
Teng, Wen-Yu
;
Tsai, Fang Lin
;
Lee, Jackson
;
Hung, Liang Yih
, et al.
소스
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :477-480 Dec, 2022
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7 . Academic Journal
Nanomechanical properties of Ag solder bumps doped with Pd and Au
저자
by
Wen, Hua-Chiang
;
Chou, Wu-Ching
;
Lin, Shiuan Huei
;
Jiang, Don Son
.
소스
In
Microelectronics Reliability
December 2017 79:270-275
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6 . Academic Journal
Using nanoindentation to investigate the temperature cycling of Sn[sbnd]37Pb solders
저자
by
Wen, Hua-Chiang
;
Chou, Wu-Ching
;
Lin, Po-Chen
;
Jeng, Yeau-Ren
;
Chen, Chien-Chang
, et al.
소스
In
Microelectronics Reliability
November 2017 78:111-117
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7 . Conference
Advanced Thermal Lid Attach Adhesive for High Performance Computing (HPC) Package
저자
by
Teng, Wen-Yu
;
Lee, Jackson
;
Tseng, Hsin-Ming
;
Hung, Liang-Yi
;
Jiang, Don Son
, et al.
소스
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :126-130 Dec, 2021
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7 . Conference
Comparison of 3D Packages with $20 \mu \mathrm{m}$ bump pitch using reflow soldering and thermal compression bonding
저자
by
Chan, Mu Hsuan
;
Chuang, Chris
;
Huang, Yu Lung
;
Chen, Wei Jhen
;
Jiang, Don Son
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :481-486 Jun, 2021
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7 . Conference
Enhance Larger FCBGA Package Evaluation and Characterization
저자
by
Lin, Vito
;
Kao, Nicholas
;
Lai, David
;
Jiang, Don Son
.
소스
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :491-494 Dec, 2019
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6 . Conference
Processing Models Based on Stress Conservation Law Utilized for Temperature-Dependent Warpage Prediction of MUF FCCSP with 3L ETS
저자
by
Chen, Chih-Sung
;
Kao, Nicholas
;
Liao, Poyu
;
Lai, Ssu-Cheng
;
Jiang, Don Son
.
소스
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :367-377 Dec, 2018
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7 . Conference
Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS
저자
by
Chen, Chih-Sung
;
Kao, Nicholas
;
Jiang, Don Son
.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :255-266 May, 2018
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5 . Conference
Larger FCBGA package with thin and normal core evaluation and characterization
저자
by
Lin, Vito
;
Kao, Nicholas
;
Jiang, Don Son
.
소스
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-4 Dec, 2017
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5 . Conference
Trend plots for compound selection utilized for warpage design of MUF FCCSP with 4L ETS
저자
by
Chen, Chih-Sung
;
Kao, Nicholas
;
Jiang, Don Son
.
소스
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-10 Dec, 2017
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