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1 . Conference
Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
저자
by
Derakhshandeh, Jaber
;
Beyne, Eric
;
Beyer, Gerald
;
Capuz, Giovanni
;
Cherman, Vladimir
, et al.
소스
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1108-1113 May, 2022
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7 . Conference
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps
저자
by
Derakhshandeh, Jaber
;
Gerets, Carine
;
Inoue, Fumihiro
;
Capuz, Giovanni
;
Cherman, Vladimir
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1119-1124 Jun, 2021
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7 . Conference
Confined IMCs for low temperature and high throughput D2W bonding
저자
by
Derakhshandeh, Jaber
;
La Tulipe, Douglas Charles
;
Capuz, Giovanni
;
Cherman, Vladimir
;
Gerets, Carine
, et al.
소스
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :131-132 May, 2022
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7 . Conference
A Highly Reliable 1.4μm Pitch Via-Last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems
저자
by
Van Huylenbroeck, Stefaan
;
De Vos, Joeri
;
El-Mekki, Zaid
;
Jamieson, Geraldine
;
Tutunjyan, Nina
, et al.
소스
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1035-1040 May, 2019
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7 . Conference
"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects
저자
by
De Vos, Joeri
;
Van Huylenbroeck, Stefaan
;
Jourdain, Anne
;
Heylen, Nancy
;
Peng, Lan
, et al.
소스
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1499-1504 May, 2018
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7 . Conference
Die to wafer 3D stacking for below 10um pitch microbumps
저자
by
Derakhshandeh, Jaber
;
Hou, Lin
;
De Preter, Inge
;
Gerets, Carine
;
Suhard, Samuel
, et al.
소스
2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016
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7 . Conference
A Highly Reliable 1×5μm Via-last TSV Module
저자
by
Van Huylenbroeck, Stefaan
;
Li, Yunlong
;
De Vos, Joeri
;
Jamieson, Geraldine
;
Tutunjyan, Nina
, et al.
소스
2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :94-96 Jun, 2018
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7 . Conference
High-Aspect-Ratio Ruthenium Lines for Buried Power Rail
저자
by
Gupta, Anshul
;
Kundu, Shreya
;
Teugels, Lieve
;
Bommels, Jurgen
;
Adelmann, Christoph
, et al.
소스
2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :4-6 Jun, 2018
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7 . Conference
Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process
저자
by
Dutta, Shibesh
;
Kundu, Shreya
;
Wen, Lianggong
;
Jamieson, Geraldine
;
Croes, Kristof
, et al.
소스
2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017
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7 . Periodical
Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
저자
by
Marinins, Aleksandrs
;
Hansch, Sebastian
;
Sar, Huseyin
;
Chancerel, Francois
;
Golshani, Negin
, et al.
소스
IEEE Journal on Selected Topics in Quantum Electronics; 2023, Vol. 29 Issue: 3 p1-11, 11p
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