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1 . Academic Journal
Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
저자
by
Sylwester Bargiel
;
Maciej Baranski
;
Maik Wiemer
;
Jörg Frömel
;
Wei-Shan Wang
, et al.
소스
Micromachines, Vol 10, Iss 3, p 185 (2019)
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7 . Academic Journal
Sealing using surface activated bonding method / 表面活性化法による封止接合(第5報)
저자
by
Frömel Jörg
;
Gessner Thomas
;
Hironao Okada
;
Jörg Frömel
;
Tadatomo Suga
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2005, :1027
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7 . Academic Journal
Decrease of Bonding Temperature and Improvement of Bonding Strength for Anodic Bonding / 陽極接合の低温化と接合強度の改善
저자
by
Fromel Jorg
;
Gessner Thomas
;
Jorg Fromel
;
Shohei Hata
;
Thomas Gessner
, et al.
소스
Proceedings of JIEP Annual Meeting. 2005, :109
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7 .
Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID
저자
by
Mario Baum
;
Jorg Fromel
;
Christian Hofmann
;
Maik Wiemer
;
Karla Hiller
, et al.
소스
2021 IEEE CPMT Symposium Japan (ICSJ)
.
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7 .
Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
저자
by
Christophe Gorecki
;
Sylwester Bargiel
;
Jörg Frömel
;
Maik Wiemer
;
Maciej Baranski
, et al.
소스
Micromachines, Vol 10, Iss 3, p 185 (2019)
Micromachines
Volume 10
Issue 3
Open Access (OpenAIRE)
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7 .
Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate
저자
by
Blandine Guichardaz
;
Etienne Herth
;
Maik Wiemer
;
Maciej Baranski
;
Sylwester Bargiel
, et al.
소스
IEEE Photonics Technology Letters
IEEE Photonics Technology Letters, Institute of Electrical and Electronics Engineers, 2014, 26, pp.100-103. ⟨10.1109/LPT.2013.2289981⟩
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7 .
Technological platform for vertical multi-wafer integration of miniature imaging instruments
저자
by
Sylwester Bargiel
;
Maik Wiemer
;
Jörg Frömel
;
Christophe Gorecki
;
D. Wünsch
, et al.
소스
SPIE Proceedings
.
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7 .
Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting
저자
by
Hideki Hirano
;
Jörg Frömel
;
Shuji Tanaka
;
Muhammad Salman Al Farisi
.
소스
Journal of Micromechanics and Microengineering
. 27:015029
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6 .
Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
저자
by
C. Jia
;
Nicolas Passilly
;
E. Herth
;
Maciej Baranski
;
Christophe Gorecki
, et al.
소스
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)
.
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7 .
3D micro-optical lens scanner made by multi-wafer bonding technology
저자
by
Nicolas Passilly
;
C. Jia
;
Maciej Baranski
;
Jörg Frömel
;
Maik Wiemer
, et al.
소스
SPIE Proceedings
.
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