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1 . Periodical
High-power EUV light sources (>500w) for high throughput in next-generation EUV lithography tools
저자
by
Burkhardt, Martin
;
van Lare, Claire
;
Hummler, Klaus
;
Zhu, Qiushi
;
Behm, Keegan
, et al.
소스
Proceedings of SPIE; April 2024, Vol. 12953 Issue: 1 p129530V-129530V-8, 1165779p
Find it @ DONGA
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7 . Conference
X-ray micro-beam diffraction measurement of the effect of thermal cycling on stress in Cu TSV: A comparative study
저자
by
Okoro, Chukwudi
;
Levine, Lyle E.
;
Xu, Ruqing
;
Hummler, Klaus
;
Obeng, Yaw
.
소스
2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1648-1651 May, 2014
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7 . Conference
Direct Cu plating of high aspect ratio through silicon vias (TSVs) with Ru seed on 300 mm wafer
저자
by
Wafula, Fred
;
Pattanaik, Gyanaranjan
;
Enloe, Jack
;
Hummler, Klaus
;
Sapp, Brian
.
소스
IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :143-146 May, 2014
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7 . Conference
Use of RF-based technique as a metrology tool for TSV reliability analysis
저자
by
Okoro, Chukwudi
;
Kabos, Pavel
;
Obrzut, Jan
;
Hummler, Klaus
;
Obeng, Yaw S.
.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :186-191 May, 2013
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7 . Conference
X-ray micro-beam diffraction determination of full stress tensors in Cu TSVs
저자
by
Okoro, Chukwudi
;
Levine, Lyle E.
;
Xu, Ruqing
;
Tischler, Jonathan Z.
;
Liu, Wenjun
, et al.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :648-652 May, 2013
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7 . Conference
Backside TSV protrusion induced by thermal shock and thermal cycling
저자
by
Zhang, Dingyou
;
Hummler, Klaus
;
Smith, Larry
;
Lu, James Jian-Qiang
.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1407-1413 May, 2013
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6 . Conference
Thermo-mechanical simulations of a copper-to-copper direct bonded 3D TSV chip package interaction test vehicle
저자
by
Park, Ah-Young
;
Ferrone, Daniel
;
Cain, Stephen
;
Jung, Dae Young
;
Murray, Bruce T.
, et al.
소스
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :2228-2234 May, 2013
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7 . Conference
Challenges in thin wafer handling and processing
저자
by
Olson, Stephen
;
Hummler, Klaus
;
Sapp, Brian
.
소스
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI. :62-65 May, 2013
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5 . Conference
TSV reveal etch for 3D integration
저자
by
Olson, Stephen
;
Hummler, Klaus
.
소스
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-4 Jan, 2012
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4 . Conference
Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis
저자
by
Lu, Kuan H.
;
Ryu, Suk-Kyu
;
Zhao, Qiu
;
Hummler, Klaus
;
Im, Jay
, et al.
소스
2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1475-1480 May, 2011
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