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1 . Academic Journal
Development of diamond milling tool using laser fixing / レーザ固着法を用いたダイヤモンドミーリング工具の開発
저자
by
Hitoshi Suwabe
;
Ken-ichi Ishikawa
;
Kosuke Takayama
;
Yoshinori Funada
;
石川 憲一
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2023, :197
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7 . Academic Journal
ダイヤモンドワイヤソーのガラス切断における加工液の効果
저자
by
Hitoshi Suwabe
;
Ken-ichi Ishikawa
;
Takahiro Urasaki
;
浦崎 貴弘
;
石川 憲一
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2022, :404
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7 . Academic Journal
4wayラップ盤における定盤の変化とウェーハ挙動の関係に関する研究
저자
by
Hitoshi Suwabe
;
Kazuma Ogami
;
Ken-ichi Ishikawa
;
大上 和真
;
石川 憲一
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2022, :392
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7 . Academic Journal
Study on factors affecting wafer actions during double-sided lapping / 両面ラッピング加工中のウェーハ挙動に影響を与える因子に関する研究
저자
by
Hitoshi SUWABE
;
Ken-ichi ISHIKAWA
;
Takuya KAMIMURA
;
上村 拓也
;
石川 憲一
, et al.
소스
砥粒加工学会誌 / Journal of the Japan Society for Abrasive Technology. 2022, 66(9):524
Open Access (JSTAGE)
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7 . Academic Journal
Study on wafer actions during double-side lapping / 両面ラッピング加工中のウェーハ挙動に関する研究
저자
by
Hitoshi Suwabe
;
Ken-ichi Ishikawa
;
Takuya Kamimura
;
上村 拓也
;
石川 憲一
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2021, :139
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7 . Academic Journal
Study on machining evaluation of diamond drill tool manufactured by laser / レーザによって作製したダイヤモンドドリル工具の加工評価に関する研究
저자
by
Hitoshi Suwabe
;
Ken-ichi Ishikawa
;
Shohei Miwa
;
Yoshinori Funada
;
三輪 昇平
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2021, :299
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7 . Academic Journal
Study on development of diamond wire tool using fiber / 線維線を用いたダイヤモンドワイヤー工具の開発に関する研究
저자
by
Hitoshi Suwabe
;
Ken-ichi Ishikawa
;
Takuki Tokimoto
;
時本 卓樹
;
石川 憲一
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2021, :297
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7 . Academic Journal
Slicing characteristics of silicon using sugar based polyol added oxidation accelerator by diamond wire saw / ダイヤモンドワイヤソーにおける酸化促進剤を添加した加工液を用いたシリコンの切断特性
저자
by
Hitoshi Suwabe
;
Ken-ichi Ishikawa
;
Mayuko Takahashi
;
Yuki Konishi
;
小西 佑基
, et al.
소스
Proceedings of JSPE Semestrial Meeting. 2021, :295
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RefWorks
7 . Academic Journal
Application of sugar-based-polyol to working fluid in wire saw / ワイヤソーにおける還元水あめの加工液への利用 —食品素材を利用した作業環境改善への取り組みの基礎研究—
저자
by
Hitoshi SUWABE
;
Mayuko TAKAHASHI
;
Takumi TOCHIO
;
Yasushi KITAGAWA
;
Yuki KIMURA
, et al.
소스
砥粒加工学会誌 / Journal of the Japan Society for Abrasive Technology. 2020, 64(9):471
Open Access (JSTAGE)
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7 . Academic Journal
Study on fixed diamond grains on resin-coated wire and slicing characteristics / 樹脂コーティングワイヤに食込む砥粒と切断特性に関する研究
저자
by
Daiki ITO
;
Hitoshi SUWABE
;
Ken-ichi ISHIKAWA
;
伊藤 大貴
;
石川 憲一
, et al.
소스
砥粒加工学会誌 / Journal of the Japan Society for Abrasive Technology. 2020, 64(9):477
Open Access (JSTAGE)
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