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1 . Academic Journal
Proposal of experimental method on fatigue of bonding materials for electronic packaging / 電子部品実装用接合材の疲労試験方法の提案
저자
by
Hisashi TANIE
;
Makoto KITANO
;
Yu HARUBEPPU
;
北野 誠
;
春別府 佑
, et al.
소스
日本機械学会論文集 / Transactions of the JSME (in Japanese). 2020, 86(883):19-00330
Open Access (JSTAGE)
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7 . Academic Journal
Proposal of experimental method on fatigue of bonding materials for electronic packaging
저자
by
Yu HARUBEPPU
;
Hisashi TANIE
;
Makoto KITANO
.
소스
Nihon Kikai Gakkai ronbunshu, Vol 86, Iss 883, Pp 19-00330-19-00330 (2020)
Open Access (JSTAGE)
Open Access (DOAJ)
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5 . Academic Journal
Thermal Deformation Analysis of Ceramic Substrate with Thick Cu Layer / 厚板Cu配線セラミックス基板の熱反り変形解析
저자
by
Hiroyuki Teshima
;
Hisashi Tanie
;
Koji Sasaki
;
Nobuhiko Chiwata
;
Yu Harubeppu
, et al.
소스
エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2019, 22(1):112
Scopus
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7 . Academic Journal
Study of Structural Reliability Evaluation by Using Extreme Value Theory / 極値統計を活用した構造信頼性評価に関する検討
저자
by
Hiroshi SHINTANI
;
Hisashi TANIE
;
新谷 寛
;
谷江 尚史
.
소스
The Proceedings of the Materials and Mechanics Conference. 2019, :0406
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6 . Academic Journal
Study on Vertical Crack Mechanism of Solder / はんだ縦クラック現象のメカニズム解明
저자
by
Daisuke KAWASE
;
Hisashi TANIE
;
Koji SASAKI
;
Osamu IKEDA
;
Takaaki MIYAZAKI
, et al.
소스
The Proceedings of the Materials and Mechanics Conference. 2019, :0312
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7 . Academic Journal
Unified experimental method on fatigue of bonding materials for power semiconductor packaging / パワー半導体実装用接合材の統一的疲労試験方法の提案
저자
by
Hisashi TANIE
;
Makoto KITANO
;
Yu HARUBEPPU
;
北野 誠
;
春別府 佑
, et al.
소스
The Proceedings of the Materials and processing conference. 2019, :223
Find it @ DONGA
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7 . Academic Journal
Unified Mechanical Experimental Method of Joining Material for Semiconductor Structure / 実装用接合材の統一的機械試験方法
저자
by
Hisashi TANIE
;
Makoto KITANO
;
Yu HARUBEPPU
;
北野 誠
;
春別府 佑
, et al.
소스
The Proceedings of Mechanical Engineering Congress, Japan. 2018, :0470105
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RefWorks
7 . Academic Journal
Joining Structure for Semiconductor Using Nano-spring layer / ナノスプリングを用いた半導体実装用接合構造
저자
by
Hisashi TANIE
;
Takashi SUMIGAWA
;
Takayuki KITAMURA
;
北村 隆行
;
澄川 貴志
, et al.
소스
The Proceedings of Mechanical Engineering Congress, Japan. 2017, :042006
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7 . Academic Journal
624 Joint Structure for Semiconductor Using Nano-spring layer / 624 ナノスプリングを用いた半導体実装用接合構造
저자
by
Hisashi TANIE
;
Takashi SUMIGAWA
;
Takayuki KITAMURA
;
北村 隆行
;
澄川 貴志
, et al.
소스
The Proceedings of the Materials and processing conference. 2015, 1
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7 . Academic Journal
625 Deformation Behavior of Ceramic Substrate with Thick Cu Layer in Joining Process / 625 厚板Cu配線セラミックス基板の接合プロセスでの変形挙動
저자
by
Hiroyuki TESHIMA
;
Hisashi TANIE
;
Koji SASAKI
;
Nobuhiko CHIWATA
;
Yu HARUBEPPU
, et al.
소스
The Proceedings of the Materials and processing conference. 2015, 1
Find it @ DONGA
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