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1 . Conference
Insight Into HCI Reliability on I/O Nitrided Devices
저자
by
Doyen, C.
;
Yon, V.
;
Garros, X.
;
Basset, L.
;
Frutuoso, T. Mota
, et al.
소스
2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-5 Mar, 2023
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7 . Conference
Parasitic Capacitance Analysis in Short Channel GaN MIS-HEMTs
저자
by
Kammeugne, R. Kom
;
Leroux, C.
;
Frutuoso, T. Mota
;
Cluzel, J.
;
Vauche, L.
, et al.
소스
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2021 - IEEE 51st European. :299-302 Sep, 2021
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7 . Conference
Impact of spacer interface charges on performance and reliability of low temperature transistors for 3D sequential integration
저자
by
Frutuoso, T. Mota
;
Lugo-Alvarez, J.
;
Garros, X.
;
Brunet, L.
;
Lacord, J.
, et al.
소스
2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-5 Mar, 2021
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7 . Conference
Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration
저자
by
Frutuoso, T. Mota
;
Garros, X.
;
Batude, P.
;
Brunet, L.
;
Lacord, J.
, et al.
소스
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :332-333 Jun, 2022
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7 . Conference
Ultra-fast CV methods (< 10µs) for interface trap spectroscopy and BTI reliability characterization using MOS capacitors
저자
by
Frutuoso, T. Mota
;
Garros, X.
;
Lugo-Alvarez, J.
;
Kammeugne, R. K.
;
Zouknak, L. D. M.
, et al.
소스
2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :3A.2-1-3A.2-6 Mar, 2022
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7 . Conference
Record RF Performance (ft=180GHz and fmax=240GHz) of a FDSOI NMOS processed within a Low Thermal Budget for 3D Sequential Integration
저자
by
Frutuoso, T. Mota
;
Lugo, J.
;
Garros, X.
;
Brunet, L.
;
Casse, M.
, et al.
소스
2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
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7 . Conference
Record Performance of 500°C Low-Temperature nMOSFETs for 3D Sequential Integration using a Smart CutTM Layer Transfer Module
저자
by
Brunet, L.
;
Reboh, S.
;
Januel, T.
;
Garros, X.
;
Frutuoso, T. Mota
, et al.
소스
2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
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7 . Conference
3D sequential integration: applications and associated key enabling modules (design & technology)
저자
by
Batude, P.
;
Billoint, O.
;
Thuries, S.
;
Malinge, P.
;
Fenouillet-Beranger, C.
, et al.
소스
2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :3.2.1-3.2.4 Dec, 2021
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7 . Conference
First Demonstration of Low Temperature (≤500°C) CMOS Devices Featuring Functional RO and SRAM Bitcells toward 3D VLSI Integration
저자
by
Fenouillet-Beranger, C.
;
Brunet, L.
;
Batude, P.
;
Brevard, L.
;
Garros, X.
, et al.
소스
2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
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7 . Periodical
On the Zero Temperature Coefficient in Cryogenic FD-SOI MOSFETs
저자
by
Catapano, E.
;
Frutuoso, T. Mota
;
Casse, M.
;
Ghibaudo, G.
.
소스
IEEE Transactions on Electron Devices; 2023, Vol. 70 Issue: 3 p845-849, 5p
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