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1 . Conference
A Lifetime Estimation Method of MMC Submodules Based on the Combination of FEA and Physical Lifetime Model
저자
by
Binyu Wang
;
Jianpeng Wang
;
Dingkun Ma
;
Laili Wang
;
Fengtao Yang
, et al.
소스
ICPE(ISPE)논문집
. 2019-05 2019(5):1511-1516
Full Text (DBPIA)
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7 .
Objective-Based Low-Frequency Parasitic Inductance Characterization Method for Power Semiconductor Package With High Power and Switching Speed
저자
by
Fengtao Yang
;
Laili Wang
;
Zizhen Cheng
;
Hongchang Cui
;
Tongyu Zhang
, et al.
소스
IEEE Transactions on Power Electronics
. 38:6886-6890
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Web of Science
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7 .
A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances
저자
by
Dingkun Ma
;
Guochun Xiao
;
Tongyu Zhang
;
Fengtao Yang
;
Mengyu Zhu
, et al.
소스
IEEE Journal of Emerging and Selected Topics in Power Electronics
. 11:1722-1736
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7 .
Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature
저자
by
Fengtao Yang
;
Laili Wang
;
Hang Kong
;
Mengyu Zhu
;
Xingshuo Liu
, et al.
소스
IEEE Transactions on Power Electronics
. 38:417-434
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7 .
Investigation and Comparison of Temperature-Sensitive Electrical Parameters of SiC MOSFET at Extremely High Temperatures
저자
by
Xiaohui Lu
;
Laili Wang
;
Qingshou Yang
;
Fengtao Yang
;
Yongmei Gan
, et al.
소스
IEEE Transactions on Power Electronics
. :1-12
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7 .
An Evaluation on Thermal Performance Improvements for SiC Power Module Integrated With Vapor Chamber in MMC
저자
by
Binyu Wang
;
Laili Wang
;
Shijie Wu
;
Zhenpeng Hou
;
Wei Mu
, et al.
소스
IEEE Journal of Emerging and Selected Topics in Power Electronics
. 10:5214-5225
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7 .
Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module
저자
by
Laili Wang
;
Tongyu Zhang
;
Fengtao Yang
;
Dingkun Ma
;
Cheng Zhao
, et al.
소스
IEEE Transactions on Power Electronics
. 37:7952-7964
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7 .
Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux
저자
by
Fengtao Yang
;
Wei Mu
;
Hong Zhang
;
Binyu Wang
;
Tongyu Zhang
, et al.
소스
IEEE Transactions on Power Electronics
. 37:5398-5410
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7 .
A Gallium Nitride Intelligent Power Module Based on Bonding Wire Interconnection
저자
by
Yilong Yao
;
Hong Zhang
;
Fengtao Yang
;
Hang Kong
;
Yan Wang
, et al.
소스
2023 IEEE Applied Power Electronics Conference and Exposition (APEC)
.
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7 .
Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement
저자
by
Cheng Zhao
;
Fan Zhang
;
Jianpeng Wang
;
Binyu Wang
;
Jia Lixin
, et al.
소스
IEEE Transactions on Power Electronics, 37(2):9520279, 1615-1629. IEEE
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